Western Digital (fremont), Inc.

Chengdu Eswin Sip Technology Co., Ltd.

Didrew Technology (bvi) Limited

Beijing Eswin Technology Co., Ltd.

Xiaotian Zhou

Feng Q Liu

Jinqiu Zhang

Minghao Shen

Ming Jiang

Hai Sun

Xiaoyu Yang

Chunbin Zhang

Hongmei Han

Zeyu Ma

Ming Sun

Shaolin Zou

Yijiang Hu

Ching-Huang Lu

Tao Pan

Lien-Chang Wang

Donghong Li

Xiaoming Du

Lieping Zhong

Wencheng Su

Hongzhou Jiang

Disclosed is a method of manufacturing a semiconductor device that includes securing a lower surface of a wafer to a supporting surface of a carrier substrate formed of copper or other metal having good thermal conductance. Further semiconductor processing for packaging can include forming an RDL on the wafer, etching scribe channels through the wafer, and coating the wafer with encapsulant. After dicing, the metal carrier remains in contact with and supporting the lower surface of the wafer, and the remainder of the wafer remains coated by the encapsulant.

Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same

Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.

Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair

Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

Method of debonding work-carrier pair with thin devices

Disclosed is a semiconductor device and method of manufacturing a semiconductor device that includes planarizing surfaces of a semiconductor substrate and a carrier substrate and then placing the semiconductor substrate on the carrier substrate such that the planarized surfaces of each are adjoining and allowing the semiconductor substrate to bond to the carrier substrate using a Van der Waals force. The method also includes forming a metal filled trench around the semiconductor substrate and in contact with the carrier substrate, which can also be formed of metal. The metal filled trench and carrier substrate together form a metal cage-like structure around the semiconductor substrate that can serve as a heat sink, integrated heat spreader, and Electro-Magnetic Interference shield for the semiconductor substrate.

Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage

Disclosed is a method of manufacturing a semiconductor device that includes adhering a plurality of semiconductor substrates and a framing member to a supporting surface of a carrier substrate. The semiconductor substrates can be wafers that can be diced or cut into a plurality of dies. Thus, the wafers each have respective active surfaces and at least one respective integrated circuit region. The method can further include encapsulating the framing member and the plurality of semiconductor substrates within an encapsulant. Subsequently, the carrier substrate is removed and a redistribution layer (RDL) is formed on the semiconductor substrates and the framing member.

Multiple wafers fabrication technique on large carrier with warpage control stiffener

Disclosed is a display module and method of manufacturing the same, where the display module comprises a LCD panel, a driver IC for driving the LCD panel, and a FPC electrically coupled to the driver IC. The LCD panel includes an array of TFT pixels on a TFT array substrate. The TFT array substrate defines a driver cavity and one or more die cavities in which the driver IC and one or more other IC dies are disposed. The driver IC includes an image signal input pad and a driving signal output pad. The driver IC is configured to receive image signals from the FPC, to process the image signals into drive signals, and to transmit the drive signals to TFT pixels via an RDL electrical connection and a through-glass via through the TFT array substrate.

System and method of manufacturing frameless LCD display

A perpendicular magnetic recording (PMR) writer is configured to magnetically record data on a rotatable disk surface. The PMR writer including a pole tip, side shields, an air-bearing surface (ABS) region, a yoke region comprising Silicon Dioxide (SiO2), side gaps and a plurality of throat regions. The side gaps are arranged respectively between the pole tip and the side shields and include SiO2. A side gap width of the plurality of throat regions increases with a side shield throat height above the ABS region for each of the throat regions. The side gap width has a different width variation in each of the throat regions.

PMR writer with non-conformal side gaps

A method provides magnetic write apparatus. A side shield location layer having a location corresponding to the side shield(s) and back and side surfaces is provided. Part of the back surface corresponds to the back surface of the side shield. A nonmagnetic layer adjoining the back and side surface(s) of the side shield location layer is provided. A pole trench is formed in the layers using a first etch process. The nonmagnetic and side shield location layers have an etch selectivity of at least 0.9 and not more than 1.1 for the first etch. A pole is provided in the pole trench. A remaining portion of the side shield location layer is removed using a wet etch. The nonmagnetic layer is nonremovable by the wet etch. Side shield(s) having a back surface substantially the same as the back surface of the side shield location layer are provided.

Method for providing a magnetic recording write apparatus by predefining side shields

A method provides a magnetic transducer having an air-bearing surface (ABS) location. An intermediate layer that includes a first sublayer in a side shield region and a second sublayer outside of the side shield region is provided. A trench is formed in the intermediate layer using multiple etches. A first etch removes part of the second sublayer, providing a first portion of the trench having a first sidewall angle. A second etch removes part of the first sublayer, providing a second portion of the trench having a second sidewall angle. The second sidewall angle is greater than the first sidewall angle. A main pole is provided in the trench and has a plurality of sidewalls. The sidewalls have the second sidewall angle in the second portion of the trench and at least one main pole sidewall angle corresponding to the first sidewall angle in the first portion of the trench.

Method for fabricating a magnetic writer using multiple etches of damascene materials

A method and system provide a magnetic transducer having an air-bearing surface (ABS) location. The method includes forming a trench in the intermediate layer using a plurality of etches. A first etch substantially provides a first portion of the trench having a first sidewall angle. The second etch substantially provides a second portion of the trench having a second sidewall angle. The second sidewall angle is greater than the first sidewall angle. The second portion of the trench includes the ABS location. The method also includes providing a main pole in the trench. The main pole has a plurality of sidewalls. The sidewalls having the first sidewall angle in the first portion of the trench and the second sidewall angle in the second portion of the trench.

Method for fabricating a magnetic writer using multiple etches

A process for manufacturing a PMR writer main pole with non-conformal side gaps is provided. The process may include depositing a stitch layer comprising a magnetic material and a second stitch layer material over a substrate, forming an air-bearing surface (ABS) region in a first damascene material, and forming a yoke region in a second damascene material. The first damascene material may include Aluminum Oxide (Al2O3). The second damascene material may include Silicon Dioxide (SiO2). Side gap regions may include SiO2.

Process for making PMR writer with non-conformal side gaps

A process for manufacturing a writer main pole for a perpendicular magnetic recording system is provided. The writer pole may have a constant sidewall angle from the ABS to yoke and may be formed out of an insulating material and a magnetic material. The sidewall angle of the yoke region may be adjusted during manufacture. The ABS region may correspond to the magnetic material and the yoke region may correspond to the insulating material. The insulating material may comprise Alumina. The magnetic material may comprise a NiFe alloy.

Process for making PMR writer with constant side wall angle

A method fabricates a magnetic transducer. A sacrificial leading shield is provided on an etch stop layer. A nonmagnetic layer is provided on the sacrificial leading shield. A pole trench is formed in the nonmagnetic layer and on the sacrificial leading shield. A pole is formed. The pole has a bottom and a top wider than the bottom in a pole tip region. Part of the pole in the pole tip region is in the pole trench and at the ABS location. The sacrificial leading shield and part of the nonmagnetic layer adjacent to the pole are removed. An air bridge thus resides in place of the sacrificial leading shield between the portion of the pole and the etch stop layer. As least one shield layer is provided. The at least one shield layer substantially fills the air bridge and form a monolithic shield including a leading and side shields.

Growing community of inventors

Fremont, CA, United States of America

Xiaotian Zhou