Shengyi Technology Co., Ltd.

Xiaosheng Su

Xianping Zeng

Yongjing Xu

Zhongqiang Yang

Shanyin Yan

Guofang Tang

Suwen Ye

Li Luo

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si&#x2014;H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board

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Guangdong, China

Xiaosheng Su