Intel Corporation

Xiaoqing Ma

Stewart M Ongchin

Vadim Sherman

Stephen Tisdale

King Gonzalez

Tieyu Zheng

Alin Ila

Mehdi Imaninejad

Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.

Package substrate dynamic pressure structure

An LGA socket assembly comprising individual sockets cells, the methods of fabricating and assembling the socket cells into a socket assembly. In an embodiment of the invention, each socket cell comprises an insulative body and a wire. The insulative body is formed around the wire. A first portion of the wire extends from the top surface of the insulative body to form contact tip. A second portion of the wire extends from the bottom surface of the insulative body to form contact paddle. Socket cells are aligned to form a socket assembly.

Land grid array (LGA) socket with cells and method of fabrication and assembly

Disclosed is a socket assembly for electrically engaging an Integrated Circuit (IC) package with a printed circuit board. The socket assembly includes a socket body and a Pick-and-Place (PnP) cap. The socket body is mounted on the printed circuit board. Further, the PnP cap is capable of detachably mounting on the socket body. An upper surface of the PnP cap includes a raised portion with multiple chamfered portions projecting out from the raised portion. The multiple chamfered portions enable easier detachment of the PnP cap from the socket body.

Pick-and-place cap for socket assembly

An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.

Apparatus and system for an IC substrate, socket, and assembly

Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

Pick-and-place cap for land grid array socket

Disclosed is a socket assembly for electrically engaging an IC package with a PCB. The socket assembly includes a socket body, a loading mechanism, and a pick-and-place (PnP) cap. The socket body engages the IC package with the PCB. The loading mechanism includes a loading plate having a central opening and capable of being mounted on the socket body when the loading plate is in a closed position. The PnP cap includes a first plurality of latches configured on a plurality of peripheral edges of the PnP cap and a raised portion configured on an upper surface of the PnP cap. The first plurality of latches engages the PnP cap with the socket body when the PnP cap is in a first position. The second plurality of latches detachably engages the PnP cap with the central opening of the loading plate when the PnP cap is in a second position.

Growing community of inventors

Gilbert, AZ, United States of America

Xiaoqing Ma