Cadence Design Systems, Inc.

Xiaopeng Dong

David Cooke Noice

William H Kao

Gary Nunn

Inhwan Seo

Vinod Kariat

Igor Keller

Sourabh Rajguru

Various embodiments provide a charge model for a cell instance for delay calculation of a circuit design that includes the cell instance, where the charge model can be part of electronic design automation (EDA) and used in timing analysis of a circuit design that includes the cell instance. The charge model generated by an embodiment can predict a charge at an input of a cell instance for an arbitrary input voltage waveform and can address (e.g., reduce or negate) a time delay impact the Miller effect has on the cell instance.

Cell instance charge model for delay calculation

An improved approach for implementing metal fill on an electrical device without causing creating cross-coupling capacitance problems is disclosed. Timing aware metal fill insertion is performed to avoid or minimize cross-capacitance problems on the IC design. A cost may be assigned to different candidate metal fill shapes. The cost is associated with the expected effect upon timing requirements by the metal fill shape, with lower costs corresponding to lower expected impacts upon the timing requirements. To meet density requirements, lower cost metal fill shapes are inserted prior to higher cost metal fill shapes.

Method and system for implementing timing aware metal fill

A method is provided to produce a model of an integrated circuit substrate, the method comprising: providing a tile definition that specifies an electrical model associated with instances of the tile; mapping a plurality of respective tile instances to respective locations of the substrate; and connecting the mapped tile instances to each other to produce a tile grid that models overall electrical behavior of the substrate.

Method to produce an electrical model of an integrated circuit substrate and related system and article of manufacture

A method is provided to evaluate substrate noise propagation in an integrated circuit design, the method comprising: providing a tile definition that specifies an electrical model associated with instances of the tile; mapping a plurality of respective tile instances to respective locations of the substrate; obtaining respective waveforms indicative of digital switching induced power grid fluctuations associated with the respective identified contacts; and associating a voltage with a selected tile instance of the tile grid that is indicative of substrate noise injection due to waveforms associated with contacts encompassed by the selected tile instance.

Method and apparatus for substrate noise analysis using substrate tile model and tile grid

A methodology is provided to perform noise analysis in the implementation stage of the design of an integrated circuit, and based upon analysis results, a floorplan may be adjusted or guard rings may be inserted to reduce the impact of digital switching noise upon noise sensitive circuits.

Method and apparatus for substrate noise aware floor planning for integrated circuit design

Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. When an engineering change order is implemented, the existing dummy metal fill geometries are initially ignored when modifying the layout, even if this results in shorts and/or other DRC violations. Once the ECO changes have been implemented, those violations caused by interaction between the changes and the metal fill are repaired afterwards.

Method and system for implementing metal fill

An improved method, system, and article of manufacture for reducing via failures is described. In one approach, additional vias or via cuts are inserted into an IC device to increase the number of cuts in a given area. The additional vias or via cuts are inserted until a sufficient via density level has been reached.

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San Jose, CA, United States of America

Xiaopeng Dong