Archers Inc.

Kla-tencor Technologies Corporation

Electroglas, Inc.

Xiaoming Wang

Lawrence Chung-Lai Lei

Tzy-Chung Terry Wu

Simon Zhu

Gene Shin

Alfred Mak

Rex Liu

Kon Park

Ronald Lloyd Rose

Samuel S Pak

Eugene Shifrin

Chien-Huei (Adam) Chen

Tsung-Pao Fang

John A Penkethman

Ning San Chang

Arye Green

Robert A Harrison

In accordance with some embodiments described herein, a method for transferring a substrate is provided. The method includes loading one or more substrates into a respective mobile chamber of one or more mobile chambers. The mobile chambers are movable on a first rail positioned adjacent to two or more process modules. Each mobile chamber is configured to maintain a specified gas condition. The respective mobile chamber is moved along the first rail. The respective mobile chamber is docked to a respective process module of the two or more process modules. At least one of the one or more substrates is conveyed from the respective mobile chamber to the respective process module.

Methods and systems of transferring, docking and processing substrates

In accordance with some embodiments described herein, a method for transferring a substrate to two or more process modules is provided, comprising loading at least one substrate into one or more mobile transverse chambers, the mobile transverse chambers being carried on a rail positioned adjacent to the two or more process modules, and wherein each mobile transverse chamber is configured to maintain a specified gas condition during conveyance of the substrate. One or more drive systems are actuated to propel at least one of the one or more mobile transverse chambers along the rail. The at least one mobile transfer chamber docks to at least one of the process modules, and the substrate is conveyed from the mobile transverse chamber to the at least one process modules.

Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.

Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer

A method of transferring one or more substrates between process modules or load lock stations while minimizing heat loss is provided. In some embodiments the method comprising the steps of: identifying a destination location Dfor a substrate Spresent at an initial processing location P; if the destination location Dis occupied with a substrate S, maintaining the substrate S1 at the initial processing location P; and if the destination location Dis available, transferring the substrate Sto the destination location D. In accordance with additional embodiments, the method is carried out on a system for processing substrates which includes two or more process modules, a substrate handling robot, a load lock chamber, and a transverse substrate handler. The transverse substrate handler includes mobile transverse chambers configured to convey substrates to process modules, wherein each mobile transverse chamber is configured to maintain a specified gas condition during the conveyance of the substrates. The transverse substrate handler further includes a rail for supporting the mobile transverse chambers, wherein the rail is positioned adjacent to entry of the process modules, and drive systems for moving the mobile transverse chambers on the rail.

Methods and systems of transferring a substrate to minimize heat loss

An improved illumination method and apparatus for optical character recognition. A first light source is positioned such that light emitted from it strikes the surface at an angle of incidence. A detector is placed at the angle of reflection, such that specularly reflected light strikes the detector, providing bright field illumination. Additional light sources positioned at angles different from the first light source are disclosed to provide for high and low angle dark field illumination. Novel light guides which allow for a compact and economic system design are also disclosed. The disclosed system utilizes light sources and filters which greatly reduce the effect of environmental lighting on the optical character recognition process. A novel method to select the optimum light source and intensity is also disclosed.

Optical character recognition illumination method and system

Growing community of inventors

San Jose, CA, United States of America

Xiaoming Wang