Disco Corporation

Xiaoming Qiu

Fumiteru Tashino

Hiroshi Morikazu

Noboru Takeda

Ken Togashi

Masashi Aoki

Satoshi Ohkawara

Naritoshi Ozawa

A gettering layer forming device includes a spinner table having a surface for holding a face side of a wafer, and an annular rest surface disposed radially outwardly of the holding surface. An annular member is located on the rest surface surrounding the wafer such that a water bath is defined by the annular member and the wafer. A moving mechanism selectively places the annular member onto the rest surface and moves the annular member away from the rest surface, an abrasive grain nozzle charges free abrasive grains into the water bath, a water nozzle supplies water to the water bath to immerse the wafer in the water, an ultrasonic horn propagates ultrasonic vibrations to the free abrasive grains in the water, and a horizontally moving mechanism moves the ultrasonic horn and the holding table horizontally relative to each other in directions parallel to the holding surface.

Gettering layer forming device and processing apparatus

An ultrasonically activated water ejector includes a cylindrical water reservoir section configured to temporarily hold water, an ejection nozzle that ejects the water from a lower part of the water reservoir section, a dome-shaped ultrasonic vibration plate disposed in an upper part of the water reservoir section, facing the ejection nozzle, and having a concave spherical surface on a lower side thereof, and a water supply portion having a supply inlet configured to supply the water along the concave spherical surface into the water reservoir section from an outer periphery toward a center of the ultrasonic vibration plate. The water is supplied from the supply inlet to the water reservoir section in an amount greater than the water to be ejected from the ejection nozzle. The water flows along the concave spherical surface from the outer periphery toward the center, and is held in the water reservoir section.

Ultrasonically activated water ejector

A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.

Production method of wafer

An ultrasonic water jet apparatus includes a water accumulation part in which the water supplied from a water supply source is temporarily accumulated, a jet port that jets the water accumulated in the water accumulation part, and a piezoelectric vibration plate including a dome part that is disposed opposed to the jet port in the water accumulation part and propagates the ultrasonic vibration to the water accumulated in the water accumulation part, a flange part that projects outward in the radial direction from a peripheral edge of the dome part, and an annular plate that projects outward in the radial direction from a peripheral edge of the flange part.

Ultrasonic water jet apparatus including piezoelectric vibration plate

A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

Grinding wheel and grinding apparatus

A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

Plate-shaped object processing method

A cleaning apparatus includes a nozzle having an ejection port, a cleaning liquid path communicating with the ejection port, and a compressed gas path communicating with the ejection port. The cleaning apparatus further includes a cleaning liquid feeding component for feeding a cleaning liquid to the cleaning liquid path, and a compressed gas feeding component for feeding a compressed gas to the compressed gas path. The compressed gas is ejected from the ejection port through the compressed gas path, while the cleaning liquid is ejected from the ejection port through the cleaning liquid path.

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Tokyo, Japan

Xiaoming Qiu