Lam Research Corporation

Xiaomin Bin

Artur Kolics

Yaxin Wang

Nanhai Li

Marina Polyanskaya

Praveen Nalla

Patrick Little

Hong Shih

Eric A Pape

Duane Outka

Cliff La Croix

William T Lee

Novy Sastrawati Tjokro

Girish M Hundi

Gregory A Pilgrim

A method for conditioning ceramic coating on a part for use in a plasma processing chamber is provided. The ceramic coating is wetted with a solution, wherein the solution is formed by mixing a solvent with an electrolyte, wherein from 1% to 10% of the electrolyte dissociates in the solution. The ceramic coating is blasted with particles. The ceramic coating is rinsed.

Method for conditioning a ceramic coating

A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Method of electroless plating using a solution with at least two borane containing reducing agents

Electroless plating solution with at least two borane containing reducing agents

A method for providing electroless deposition of a metal layer on a plurality of metal patterns, wherein a dielectric surface is between some of the plurality of metal patterns and metal residue is on the dielectric surface is provided. The dielectric surface is pretreated with an alkaline solution with a pH of at least 8 comprising at least one complexing agent, wherein the complexing agent forms a metal complex with the metal residue and wherein some metal oxide residue remains. The dielectric surface is pretreated with an acidic solution, wherein the acidic solution dissolves metal oxide residue. Metal is electrolessly deposited on the plurality of metal patterns.

Process to reduce nodule formation in electroless plating

A method for providing metal filled features in a layer is provided. A nonconformal metal seed layer is deposited on tops, sidewalls, and bottoms of the features, wherein more seed layer is deposited on tops and bottoms of features than sidewalls. The metal seed layer are etched back on tops, sidewalls, and bottoms of the features, wherein some metal seed layer remains on tops and bottoms of the features. Deposition on the seed layer on tops of the features is suppressed. An electroless 'bottom up' deposition of metal is provided to fill the features.

Electroless copper deposition with suppressor

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Xiaomin Bin