Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Xiaomeng Hou

Zhuo Zhang

Yongzhen Jia

Chunmei He

Guochun Yan

Haochun Lee

Yuan Zhao

Wenbo Dong

Quanming Bai

A display panel and a manufacturing method thereof are provided. The display panel includes a buffer layer and/or at least one adhesive layer. The buffer layer is disposed on a bottom of the display panel, and the adhesive layer is disposed between two of adjacent layers in a layered structure of the display panel. Wherein, the buffer layer and the adhesive layer have materials having Poisson's ratio of less than 0.1.

Display panel and manufacturing method thereof

A flexible display device includes a flexible display panel bendable along a bending axis. A support backplate is disposed on a side of the flexible display panel and located on an outer side of the flexible display panel when bending. The support backplate includes a support area and a plurality of extension areas defined on opposite sides of the bending axis and adjoining two sides of the support area. When the flexible display device is in an expanded state, a difference value between a length of the support backplate and a length of the flexible display panel in a direction perpendicular to the bending axis is greater than or equal to a first threshold. The flexible display device can reduce the risk of peeling of components in a bent state and can ensure a product lifespan.

Flexible display device

The present application provides a foldable display module. The foldable display module includes a flexible display panel, a first module, and a second module. The flexible display panel is disposed between the first module and the second module. A ratio of a rigidity of the first module to a rigidity of the second module ranges from 0.8 to 1.2.

Foldable display module

An organic electroluminescence device is disclosed. The organic electroluminescence device includes a light emitting layer disposed on a substrate and an encapsulation layer covering the light emitting layer. The encapsulation layer includes at least one inorganic layer and at least one organic layer, wherein the inorganic layer and the organic layer of the encapsulation layer are disposed alternately, and the at least one inorganic layer is disposed on the light emitting layer and covers the light emitting layer; and two buffer layers, wherein each of the buffer layers is disposed between the inorganic layer and the organic layer which are adjacent, and a material of the buffer layer is at least one of a tetramethylsilane monomer, an ethoxysilane monomer, or a silicon oxycarbide monomer.

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Hubei, China

Xiaomeng Hou