Dow Global Technolgoies LLC

Dow Silicones Corporation

Ddp Specialty Electronic Materials Us, LLC

Rohm and Haas Company

The Dow Chemical Company

Xiaomei Song

Hongyu Chen

Yi Zhang

Dakai D Ren

Guodong Shen

Wei Zhang

Yu Zhang

Yu Chen

Yu Wang

Yan Huang

Yabin Sun

Mark Alan Barger

Wenjie Chen

Yunlong Guo

Chung Mien Kuo

Youjun Wu

Jeffrey M Alcott

Ernest J Herst

Xiaoxiong Miao

Linfei Wang

Chungmien Kuo

Jo Gunn

Hongyu Cheng

Wei Li

A composition which provides a coating film having excellent foul releasing property is disclosed. The composition comprises, based on the solid contents of the composition: (A) 20 to 80 weight % of a resin which has a polydialkylsiloxane unit and an epoxy resin unit within its structure; (B) 0.1 to 5 weight % of an amino silane; (C) 0.5 to 5 weight % of a hydrophilic additive; and (D) 0.1 to 5 weight % of a catalyst. A coating, e.g. a coating film, formed from the composition generally has an amphiphilic surface. Thus, the composition is suitable for coatings which prevent both hydrophobic and hydrophilic fouling.

Polysiloxane resin composition

A coating composition is disclosed. The coating composition is useful for providing a coating, e.g. on a surface of an article. The coating provides very low adhesion to ice, faster ice removal by heating power, etc. The coating composition comprises a silicone rubber, a thermal conductive filler, a reactive polysiloxane, an unsaturated group containing alkoxysilane, a catalyst, and a solvent.

Thermally conductive ice-phobic coatings

An article contains a polymeric foam board having a primary surface and an intumescent coating on a primary surface of the polymeric foam board, the intumescent coating containing a polymeric binder, expandable graphite particles, a phosphorous material and a boron-containing compound and wherein the article is free of an object that is in contact with the intumescent coating and that sandwiches the intumescent coating between it and the polymeric foam board and wherein the intumescent coating has a tensile elongation of at least 50 percent and less than 100 percent at 23 degrees Celsius as measured according to ISO 37, has a storage modulus of less than 1&#xd7;10Pascals at 250 degrees Celsius, is halogen-free, free of sodium silicate, free of polyurea elastomer, and free of formals of pentaerythritol and dipentaerythritol.

Polymeric foam board with flexible water resistant intumescent coating

An intumescent coating system contains: a polyol component; an isocyanate component; a latent crosslinker having two or more &#x2014;NACHOR groups, where A is selected from a group consisting of H and &#x2014;CHOR, and in each case R is independently selected from a group consisting of hydrocarbons having from one to four carbons, the latent crosslinker being present at a concentration of 30 weight-percent or more based on polyol weight; a boron component one weight-percent or more and 10 weight-percent or less based on total weight of the formulation; and expandable graphite at a concentration of 10 weight-percent or more and 50 weight-percent or less based on the total intumescent system weight; where the polyol and isocyanate are selected so that the reaction product at room temperature of the intumescent coating system components produces a coating having a tensile elongation of 40-percent or more as determined according to ISO 37.

Intumescent coating system

Semiconductive shield layers for power cable constructions are made from a composition that has: (A) A nonpolar, ethylene-based polymer having a density of greater than (&#x3e;) 0.90 glee and a melt index of &#x3e;20 g/10 min at 190&#xb0; C./2.16 Kg; (B) A polar polymer consisting of ethylene and an unsaturated alkyl ester having 4 to 20 carbon atoms; (C) Acetylene carbon black; and (D) A curing agent; with the provisos that (1) the composition has a phase separated structure, and (2) the weight ratio of nonpolar polymer to polar polymer is from 0.25 to 4.

Semiconductive shield free of weld lines and protrusions

An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150&#xb0; C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

Cured thermoset for high thermal conductive materials

This invention relates to an epoxy resin composition and its application in marine maintenance and repair coating with improved overcoatability.

Epoxy resin composition for marine maintenance and repair coatings with improved overcoatability

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Shanghai, China

Xiaomei Song