Bridgelux Incorporated

Xiaolu Chen

Wenhui Zhang

Scott H West

Robert Tudhope

A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection.

Optics for chip-on-board road and area lighting

A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. The protrusion extends substantially in a light emission direction and is shaped the protrusion to direct light emitted from the light source in a desired direction.

Optics for chip-on-board lighting having a protrusion

A solid-state light-emitting device ('SLD') converting electrical energy to photon energy using a light emitter diode ('LED') and high-temperature multi-layer optics (&#x201c;HMO&#x201d;) is disclosed. The SLD, in one aspect, includes a chip-on-board (&#x201c;COB&#x201d;), a silicone inner layer (&#x201c;SIL&#x201d;), and a Poly methyl methacrylate (&#x201c;PMMA&#x201d;) layer. The COB includes a first surface and a second surface wherein the first surface includes at least one LED. The LED converts electrical energy to optical light and the light subsequently leaves the LED becoming visible light. The SIL includes a first silicone surface and a second silicone surface wherein the second silicone surface is in contact with the first surface of COB and the second silicone surface is in contact with the PMMA layer. The operating temperature of PMMA layer is lower than the operating temperature of SIL.

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Fremont, CA, United States of America

Xiaolu Chen