Ruijie Networks Co., Ltd.

Xiaolong Lv

Wei Liu

Guohong Lai

This application discloses a heat dissipation structure for an optoelectronic module and an electronic device. The heat dissipation structure includes: an electronic chip; a plurality of optical engines, the plurality of optical engines being distributed along a periphery of the electronic chip; and a cold plate. The cold plate includes: a main cold plate for dissipating heat for the electronic chip; a secondary cold plate for dissipating heat for at least one of the plurality of optical engines; and a heat pipe assembly corresponding to the secondary cold plate. The heat pipe assembly includes at least one heat pipe, which has an evaporating end connected to the secondary cold plate and a condensing end connected to the main cold plate. The main cold plate is equipped with a flow channel for dissipating heat for the heat pipe assembly, and the secondary cold plate has a maintenance operation position.

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Fujian, China

Xiaolong Lv