Philips Lumileds Lighting Company LLC

Koninklijke Philips Corporation N.v.

Xiaolin Sun

Decai Sun

Oleg Borisovich Shchekin

A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier.

Process for preparing a semiconductor structure for mounting

A process for preparing a semiconductor light-emitting device for mounting is disclosed. The light-emitting device has a mounting face for mounting to a sub-mount. The process involves treating at least one surface of the light-emitting device other than the mounting face to lower a surface energy of the at least one surface, such that when mounting the light-emitting device, an underfill material applied between the mounting face and the sub-mount is inhibited from contaminating the at least one surface.

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Pleasanton, CA, United States of America

Xiaolin Sun