Hefei University of Technology

Hangzhou Silan Microelectronics Co., Ltd.

Hangzhou Silan Integrated Circuits Co., Ltd.

XiaoLi Zhang

Feng Ji

Chen Liu

Yongxiang Wen

Kemin Xue

Lanqing Yang

Miao Meng

Siliang Yan

Yuhong Gong

An electrically-assisted tooth-shaped rolling process and device for preparing a gradient ultrafine-grained sheet is provided. A rib-forming pressure roller, a rib-flatting pressure roller and a straightening pressure roller are adopted to sequentially roll relative to a surface of a sheet under a preset pressing force. The surface of the sheet is driven, under a rib forming process, to generate large deformation in micro-area to crush and refine grains, and under a rib flatting process to generate reverse large deformation in micro-area. Large deformation areas in the rib forming process and the rib flatting process are staggered to further crush and refine the grains. A cold straightening process drives the sheet to be restored to an original shape, so that the sheet becomes the gradient ultrafine-grained sheet with a decreasing grain size gradient from an interior to a surface layer.

Electrically-assisted tooth-shaped rolling process and device for preparing gradient ultrafine-grained sheet

Disclosed a MEMS assembly and a manufacturing method thereof. The manufacturing method comprises: forming a groove on a sensor chip; forming a bonding pad on a circuit chip; bonding the sensor chip and the circuit chip together to form a bonding assembly; performing a first dicing process at a first position of the sensor chip to penetrate through the sensor chip to the groove; performing a second dicing process at a second position of the sensor chip to penetrate through the sensor chip and the circuit chip, for obtaining an individual MEMS assembly by singulating the bonding assembly, wherein location of the groove corresponds to a position of the bonding pad, and an opening is formed in the sensor chip to expose the bonding pad when the second dicing process is performed. The method uses two dicing process respectively achieving different depths to expose the bonding pad of the sensor chip and singulate the MEMS assembly, respectively, to improve yield and reliability.

MEMS assembly and manufacturing method thereof

Growing community of inventors

Hangzhou, China

XiaoLi Zhang