Huawei Technologies Co., Limited

Xiaokang Xiao

Jun Luo

Zengguang Guo

An electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up. The reinforcing layer is provided with a window that passes through the reinforcing layer. The electrical signal layer is adjacent to the window. The packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.

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Dongguan, China

Xiaokang Xiao