Agere Systems Inc.

Agency for Science, Technology and Research

Xiaojun Yuan

Ranbir Singh

Alan Sangone Chen

Nace Rossi

Mark Dyson

Yuan Gao

Hyouk Kyu Cha

An amplifier and a transceiver including the amplifier are provided. The amplifier includes an input terminal; a first transistor of a first conductivity and a second transistor of a second conductivity, each transistor comprising a source terminal, a gate terminal and a drain terminal respectively, the source terminal of the first transistor being coupled to the source terminal of the second transistor, and the gate terminal of the first transistor and the gate terminal of the second transistor being coupled to the input terminal; and an output terminal coupled to the drain terminal of the first transistor and the drain terminal of the second transistor.

Amplifier and transceiver including the amplifier

The invention, in one aspect, provides a method for fabricating a semiconductor device. In one aspect, the method provides for a dual implantation of a tub of a bipolar transistor. The tub in bipolar region is implanted by implanting the tub through separate implant masks that are also used to implant tubs associated with MOS fabricate different voltage devices in a non-bipolar region during the fabrication of MOS transistors.

Method to reduce collector resistance of a bipolar transistor and integration into a standard CMOS flow

The invention, in one aspect, provides a method of manufacturing a semiconductor device. This aspect includes forming gate electrodes in a non-bipolar transistor region of a semiconductor substrate, placing a polysilicon layer over the gate electrodes in the non-bipolar transistor region and over the semiconductor substrate within a bipolar transistor region. A protective layer is formed over the polysilicon layer. The protective layer has a weight percent of hydrogen that is less than about 9% and is selective to silicon germanium (SiGe), such that SiGe does not form on the protective layer. This aspect further includes forming emitters for bipolar transistors in the bipolar transistor region, including forming a SiGe layer under a portion of the polysilicon layer.

Method to reduce boron penetration in a SiGe bipolar device

Growing community of inventors

Singapore, Singapore

Xiaojun Yuan