Skyworks Solutions, Inc.

XiaoJun Chew

Mitsuhiro Furukawa

Wilfred Ryan Vidamo Habana

Hidekazu Nakanishi

A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has a marking layer disposed on a bottom surface of the cap substrate that is disposed above and faces the acoustic wave device. The marking layer is configured to receive one or more markings thereon.

Cap substrate for acoustic wave device

A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof. The metal layer is paced from and faces the acoustic wave device.

Growing community of inventors

Singapore, Singapore

XiaoJun Chew