International Business Machines Corporation

Elpis Technologies Inc.

Xiaojin Wei

Allan C VanDeventer

John G Torok

Noah B Singer

Robert K Mullady

Raschid Jose Bezama

Robert B Schlak

Mitchell Zapotoski

Evan G Colgan

Ping-Chuan Wang

Kamal Kumar Sikka

Gary Franklin Goth

Michael T Peets

John Harold Magerlein

Kenneth Charles Marston

M Dean Sciacca

Edward W Chencinski

Craig A Bickelman

Seth R Greenspan

Huilong Zhu

Michael A Gaynes

Timothy Harrison Daubenspeck

Timothy Dooling Sullivan

Kai D Feng

Louis Lu-Chen Hsu

Yves Corfield Martin

Sushumna Iruvanti

Steven Lorenz Wright

Thomas Anthony Wassick

Phillip Duane Isaacs

Krystyna Waleria Semkow

Eric James McKeever

Ian D Melville

Francis R Krug, Jr

Donald W Porter

Ekta Misra

Robin A Susko

Robert Philip Makowicki

Jamil A Wakil

Jiantao Zheng

Steven G Shevach

George John Scott

Gary Lafontant

Richard P Snider

Theodore Van Kessel

Gerald Keith Bartley

Alvin Jose Joseph

David L Questad

Jeffrey Allen Zitz

Zhijian Yang

Steven C McIntosh

Thomas J Fleischman

Amilcar R Arvelo

Steven John Ahladas

Virendra R Jadhav

William P Kostenko

David R Motschman

Kathryn C Rivera

Donald J Papae

Frank E Bosco

Seth E Bard

An apparatus for cooling and containing packaged battery cells includes a first structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the circuit board, the first structure includes an external surface and an internal surface defining a first cavity in which the first battery cell is located. The apparatus further includes a first seal surrounding the first battery cell between the printed circuit board coupled to the first structure. The apparatus further includes a first thermal interface material located in the first cavity, wherein a first portion of the first thermal interface material is thermally coupled to an interior surface and a second portion of the first thermal interface material is thermally coupled to the first battery cell. The apparatus further includes a plurality of heatsink fins located on the external surface of the first structure.

Containment heatsink for packaged battery cells

The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Heat pipe and vapor chamber heat dissipation

Managing of battery pack cell capacity is provided. The managing includes monitoring temperature of one or more cells within the battery pack, and based on temperature of a cell of the one or more cells being at or below a low temperature threshold, initiating discharging of cells with the battery pack at a specified discharge power level to heat the cells within the battery pack. The managing also includes, based on temperature of a cell of the one or more cells rising to or above an upper temperature threshold after initiating discharging of the cells within the battery pack, discontinuing the discharging of cells within the battery pack.

Battery pack capacity optimization via self-regulation of cell temperature

An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Cooled containment compartments for packaged battery cells

Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Manufacturing electronic package with heat transfer element(s)

A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Flexible coolant manifold&#x2014;heat sink assembly

An apparatus is provided which includes a changeable cover assembly sized to cover, at least in part, an air outlet side of an electronics rack. The cover assembly, when positioned at the air outlet side of the rack, redirects and vents airflow egressing from the air outlet side. The cover assembly includes a frame and at least one vent cover. The frame has at least one opening through which air egressing from the electronics rack passes, and the vent cover(s) is coupled to the frame and overlies, at least in part, the opening(s) in the frame to facilitate redirecting and venting the air passing through the frame. The at least one vent cover is changeable to change a direction of the vented air. For instance, the vent cover(s) may be reversible, or otherwise adjustable or changeable, to change the direction of vented air egressing from the cover assembly.

Changeable, airflow venting cover assembly for an electronics rack

One aspect is a method that includes applying a plurality of incrementally varying voltage targets to a plurality of power phase converters operating in parallel between a source voltage rail and a load voltage rail. A phase temperature of each of the power phase converters is monitored. The phase temperature of each of the power phase converters is compared to a thermal adjustment limit. One or more of the power phase converters are adjusted to reduce an associated output current based on determining that at least one of the power phase converters exceeds the thermal adjustment limit. Power phase converter adjustments can be performed in a balanced manner such that a net sum voltage at the load voltage rail is substantially unchanged after the adjustments.

Thermal management in a multi-phase power system

Embodiments relate to controlling a temperature of a solid state memory device using queue depth management by monitoring an operating temperature of each of a plurality of solid state drives of the solid state memory device. Based on a determination that the operating temperature of one of the plurality of solid state drives exceeds local device threshold values, the method includes receiving an indication that one or more local measures have been taken by the solid state memory device. Based on a determination that the operating temperature of one of the plurality of solid state drives exceeds a secondary global threshold value, the method includes reducing a queue length for the solid state memory device.

Control of solid state memory device temperature using queue depth management

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Poughkeepsie, NY, United States of America

Xiaojin Wei