Aac Acoustic Technologies (shenzhen) Co., Ltd.

Aac Technologies Pte. Ltd.

Xiaohui Zhong

Kahkeen Lai

Hui Zhang

Lian Duan

Zhan Zhan

Lieng Loo

Bei Tong

Shaoquan Wang

Rui Guo Zhang

Linlin Wang

Zhenkui Meng

Kianheng Goh

Goh Wan Ling Serene

Loo Li Eng

Tan Qiu Yu Veronica

Lin Yih Shung

Lai Kah Keen

The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

MEMS microphone

The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Piezoelectric type and capacitive type combined MEMS microphone

The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 &#x3bc;m. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.

Method for processing conductive structure

The present invention provides a manufacturing method for MEMS structure. The method includes steps of: S: providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer; S: carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer; and S: carrying out an over-etching process for deepening the cavity hole and control an included angle &#x3b1; between a side wall of the cavity hole and the structural layer to be larger than 10&#xb0; but smaller than 90&#xb0;. The invention also provides a MEMS structural and a MEMS microphone manufactured by the method.

MEMS microphone and manufacturing method for making same

A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

Method for manufacturing microphone chip

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Xiaohui Zhong