Huawei Technologies Co., Limited

Lenovo (beijing) Limited

Xiaogang Lu

Liang Cheng

Dongfeng Li

Hongliang Gao

Zhirong Gao

Guodong Jiang

Juanna Dang

A routing entry generation method and apparatus and a trie generation method and apparatus, such that the routing entry generation method includes: obtaining M first routing entries, where each first routing entry includes a correspondence between a route and an outbound interface, and M&#x2265;2; and combining the M first routing entries to generate N second routing entries, where at least one of the N second routing entries includes a correspondence between a common route and an outbound interface, the common route is used to indicate two or more routes, N&#x3c;M, and both N and M are integers.

Routing entry generation method and apparatus and trie generation method and apparatus

A heat dissipation structure is provided for an electronic device. The heat dissipation structure includes a substrate and cooling fins connected to the substrate. The substrate includes a thermally conductive material. A first surface of the substrate has a plurality of contact regions. The plurality of contact regions of the first surface contact at least one device to be cooled.

Heat dissipation structure and electronic device

Growing community of inventors

Beijing, China

Xiaogang Lu