C3nano Inc.

Littelfuse, Inc.

Ekc Technology Inc.

Shocking Technologies, Inc.

Xiaofeng Chen

Ajay Virkar

Xiqiang Yang

Ying-Syi Li

Steven Michael Lam

Hua Gu

Christopher Steven Scully

Alex Da Zhang Tan

Yu Kambe

Arthur Yung-Chi Cheng

Melanie Mariko Inouye

Melanie Maniko Inouye

Robert J Fleming

Lex Alan Kosowsky

Bhret Robert Graydon

Shurui Shang

Glen Irvin

Yadong Cao

Byunghwan Kang

Jackie Chen

Vicki Luo

Andrew Hyeongjoo Moon

Authur Yung-Chi Cheng

Methods for processing deposited metal nanowire inks with metal ions are used to form fused metal nanostructured networks. The metal nanowire inks include a hydrophilic polymer binder, such as a cellulose based binder. The metal nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Method for processing metal nanowire ink with metal ions

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures

Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Metal nanowire ink for the formation of transparent conductive films with fused networks

Metal nanowire ink and method for forming conductive film

Transparent conductive films with fused networks

Metal nanowire inks for the formation of transparent conductive films with fused networks

A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.

Method of manufacturing a substrate having a voltage switchable dielectric material

Substrates having voltage switchable dielectric materials

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San Jose, CA, United States of America

Xiaofeng Chen