Purdue Research Foundation

Carrier Corporation

Xiaofan Jiang

Dimitrios Peroulis

Alina Alexeenko

Nithin Raghunathan

Petr Kazarin

A virtual thermocouple system for non-invasively predicting product characteristics is disclosed, which includes one or more temperature sensing systems including a resistive network which includes a temperature sensing device comprising a plurality of negative temperature coefficient (NTC) thermistors, and a load resistor, a corresponding system-on-chip coupled to a corresponding resistive network and configured to i) power the corresponding resistive network, ii) receive corresponding signals from each NTC thermistor of the corresponding temperature sensing device, iii) process the signal associated with each NTC thermistor of the corresponding temperature sensing device and thus generate data associated with each NTC thermistor, and iv) transmitting the processed data, a power generating device configured to provide power to the corresponding system-on-chip, and a base stations adapted to i) receive the processed data from a corresponding system-on-chip, and ii) using a predefined model, and non-invasively translate the processed data to thermal characteristics of a product.

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West Lafayette, IN, United States of America

Xiaofan Jiang