Shanghai Huali Microelectronics Corporation

Xiaobin Zhu

Yu Zhang

Xiaolong Wang

Lijun Chen

Haichang Zheng

The present application discloses a method for measuring stitching overlay accuracy of image sensor stitching manufacturing, forming an A-type overlay pattern mark and a corresponding B-type overlay pattern mark on the edge of each rectangular pixel area to be stitched; after the A-type overlay pattern mark and the B-type overlay pattern mark are stitched and exposed, performing metrology by means of a scanning electron microscope to obtain dimension features; and according to the dimension features of the A-type overlay pattern mark and the B-type overlay pattern mark stitched together and exposed and measured by the scanning electron microscope, determining stitching overlay accuracy of two adjacent rectangular pixel areas. The present application can achieve direct metrology on the overlay pattern mark on the stitched pixel area of a product, facilitating timely and accurate monitoring on the stitching overlay accuracy of image sensor stitching manufacturing.

Method for measuring stitching overlay accuracy of image sensor stitching manufacturing

The present application discloses an image stitching method for a stitching product, which includes: step 1: providing a chip design layout of the stitching product; step 2: designing a mask layout according to the chip design layout, including: step 21: setting unit mask images; step 22: merging logic images or cutting path images of adjacent areas between unit regions together to set corresponding peripheral mask images; step 23: merging the same peripheral mask images into one; step 24: constituting a mask layer by using the unit mask images and each peripheral mask image, and forming the mask layout on a mask; step 3: performing repeated exposure to form the stitching product. The present application can reduce the number of mask images, the number of times of exposure and the time of exposure.

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Shanghai, China

Xiaobin Zhu