Mcube, Inc.

Miradia Inc.

Xiao “Charles” Yang

Dongmin Chen

Hong Wan

Philip H Chen

Sudheer S Sridharamurthy

George Hsu

A sensor processor system is provided on a platform including a semiconductor substrate. The system has multiple integrated subsystems including a micro controller unit provided on one or more first regions of the semiconductor substrate. The subsystems also include an array of programmable memory provided on one or more second regions of the semiconductor substrate, among other elements. The subsystems also include one or more MEMS devices operably coupled to the micro controller unit. In one or more embodiments, an application processor is coupled to the semiconductor substrate and, optionally, a baseband processor is coupled to the semiconductor substrate.

System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process

An integrated MEMS system in which CMOS and MEMS devices are provided to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured.

System on a chip using integrated MEMS and CMOS devices

A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

Method and device for wafer scale packaging of optical devices using a scribe and break process

A handheld device and methods of operation. The device includes a housing and a display. A device may include a MEMS inertial sensor disposed within the housing, wherein the MEMS inertial sensor is configured to sense a change in spatial orientation when the user reorients the handheld device. A system may include a processor disposed within the housing and coupled to the MEMS inertial sensor and to the display, wherein the processor is programmed to receive the change in spatial orientation of the handheld device, and wherein the processor is programmed output an indication of the change in spatial orientation on the display. A computer implemented method for a handheld computer system for determining spatial orientation is also disclosed.

Methods and apparatus for operating hysteresis on a hand held device

A method and structure for fabricating an inertial sensing device using tilt conversion to sense a force in the out-of-plane direction. The method can include forming anchor structure(s) coupled to portions of a surface region of a substrate member. Also, the method can include forming flexible anchor members coupled to portions of the anchor structures and frame structures, which can be formed overlying the substrate. The method can also include forming flexible frame members coupled to portions of the frame structures and movable structures, which can also be formed overlying the substrate. Forming the movable structures can include forming peripheral and central movable structures, which can be coupled to flexible structure members. Peripheral movable structures having flexible tilting members can convert a pure tilting out-of-plane motion to a pure translational out-of-plane motion. The forming of these elements can include performing an etching process on a single silicon material.

Method and structure of an inertial sensor using tilt conversion

An integrated MEMS System. CMOS and MEMS devices can be provided in order to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured. The integrated MEMS devices can include, but not exclusively, an combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices. The present technique provides an easy to use process that relies upon conventional process technology without substantial modifications to conventional equipment and process and reduces off-chip connections, which make the mass production of smaller and thinner units possible.

Integrated system on chip using multiple MEMS and CMOS devices

A computer implemented method for determining an intensity of user input to a computer system, performed by the computer system that is programmed to perform the method includes determining by a display, an indication of a finger position a user in response to a change in finger position relative to the computer system, wherein change in fin position is also associated with a magnitude of change, determining by a physical sensor of the computer system, the magnitude of change in response to the change in finger position, determining by the computer system, a user selection of a function to perform in response to the indication of the finger position, determining by the computer system, an input parameter associated with the function in response to the magnitude of change, and initiating performance by the computer system, of the function in response to the input parameter.

Analog touchscreen methods and apparatus

An apparatus for inertial sensing. The apparatus includes a substrate member comprising a thickness of silicon. The apparatus also has a first surface region configured from a first crystallographic plane of the substrate and a second plane region configured from a second crystallographic plane of the substrate. The apparatus has a quartz inertial sensing device coupled to the first surface region, and one or more MEMS inertial sensing devices coupled to the second plane region.

Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes

Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits. A first portion and a second portion of the metal conductor, which can be electrically isolated within a CMOS IC device, can be etched to form an unetched portion of the metal conductor. The MEMS device can be patterned, from a MEMS layer formed overlying the metal conductor, via a plasma etching process, during which the unetched portion of the metal conductor is protected from the plasma. The metal conductor can be electrically coupled to the CMOS IC device via a conductive jumper or the like. Furthermore, the integrated CMOS-MEMS device can include a MEMS device coupled to a CMOS IC device via an electrically isolated metal conductor within the CMOS IC device. Also, the metal conductor can be electrically coupled to the substrate of the CMOS IC device via a conductive jumper.

Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits

A computer implemented method for performing a user-defined function in a computer system, performed by the computer system that is programmed to perform the method includes determining by a display a display position in response to a change and a rate change in state of a user-controlled user input device, determining by a physical sensor a magnitude of change in sensed physical in response to the rate of change in the state, determining whether the magnitude of change exceeds a threshold level, determining a function to perform in response to display position when magnitude of change in sensed physical properties exceeds the threshold level, initiating performance of the function in response to the function, and inhibiting performance of the function when the magnitude of change in sensed physical properties does not exceed the threshold level.

Touchscreen operation threshold methods and apparatus

An integrated multi-axis mechanical device and integrated circuit system. The integrated system can include a silicon substrate layer, a CMOS device region, four or more mechanical devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, on which any number of CMOS and mechanical devices can be configured. The mechanical devices can include MEMS devices configured for multiple axes or for at least a first direction. The CMOS layer can be deposited on the silicon substrate and can include any number of metal layers and can be provided on any type of design rule. The integrated MEMS devices can include, but not exclusively, any combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices.

Multi-axis integrated MEMS devices with CMOS circuits and method therefor

An integrated inertial sensing device. The device includes a substrate member. The device also has a first inertial sensing device comprising at least a first material and configured to detect at least a first direction. The device has a second inertial sensing device comprising at least the first material and configured to detect at least a second direction. The device also has a third inertial sensing device comprising at least a quartz material and configured to detect at least a third direction. The three devices can be integrated to form an integrated inertial sensing device.

Accurate gyroscope device using MEMS and quartz

A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.

Three axis magnetic sensor device and method

A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting is presented. The method includes providing a substrate having a surface region and forming sensor(s) or electronic device(s) on a first region overlying the surface region. At least one bond pad structure can be formed from at least one trench structure. The resulting device can then be singulated within a vicinity of the bond pad structure(s) to form at least one integrated sensor or electronic devices having at least one vertical bond pad. At least one singulated device(s) can be coupled to a package, having a package surface region, such that the vertical bond pad(s) are configured horizontally, and at least one interconnection can be formed between the vertical bond pad(s) and at least one portion of the package surface region.

Method and structure of sensors or electronic devices using vertical mounting

A method and structure for fabricating a monolithic integrated CMOS and MEMS device. The method includes providing a first semiconductor substrate having a first surface region and forming one or more CMOS IC devices on a CMOS IC device region overlying the first surface region. The CMOS IC device region can also have a CMOS surface region. A bonding material can be formed overlying the CMOS surface region to form an interface by which a second semiconductor substrate can be joined to the CMOS surface region. The second semiconductor substrate having a second surface region to the CMOS surface region by bonding the second surface region to the bonding material, the second semiconductor substrate comprising one or more first air dielectric regions. One or more free standing MEMS structures can be formed within one or more portions of the processed first substrate.

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Cupertino, CA, United States of America

Xiao “Charles” Yang