Ati Technologies Ulc

Advanced Micro Devices Corporation

Xiao Ling Shi

Roden R Topacio

Fei Guo

Liane Martinez

Suming Hu

Terence Cheung

Mark Frankovitch

Wasim Ullah

A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.

Thermal management circuit board for stacked semiconductor chip device

Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit board with a second signal trace. A first guard trace is formed on the first layer and offset laterally from the first signal trace but at least partially overlapping the second signal trace and a second guard trace is formed on the second layer and offset laterally from the second signal trace but at least partially overlapping the first signal trace.

Wave guiding structures for crosstalk reduction

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Xiao Ling Shi