Fih (hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Ykk Corporation

Xiao-Kai Liu

Chang-Hai Gu

Chao-Hsun Lin

Wu-Zheng Ou

Po-Feng Ho

Yu-Tsai Wang

Wei-Ben Chen

Yao-Yao Qin

Jing-Hai Zheng

Zheng Jin

Dan Wang

A method of making a housing includes: providing a substrate and cutting the substrate to form an opening. The substrate being spaced by the opening to form at least one main base. A plurality of metal sheets and a plurality of reinforcing members are provided. Placing the metal sheets, the reinforcing members and the main base into a mold. The metal sheets is positioned in the opening, adjusts width of each gap between adjacent metal sheets, and between the main base and one metal sheet adjacent to the main base. Locating the reinforcing members in the metal sheets and the main base. Liquid resin is filled into the gaps and covers the reinforcing members to bond the metal sheets, the main base and the reinforcing members together, forming the housing.

Method for making housing

A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

Housing and electronic device using the same

A housing includes a metal substrate, an adhesive layer formed on the metal substrate, and a resin film formed on the adhesive layer, the metal substrate, the adhesive layer and the resin film cooperatively form a cavity through a stamping process, an internal structure needed by the housing is formed in the cavity through an injection process, and the internal structure is formed on the resin film.

Housing, electronic device using same, and method for making same

A housing includes a substrate having an opening, a plurality of metal sheets and a plurality of reinforcing members, the metal sheets are positioned in the opening, the reinforcing members inlaid in the metal sheets and the substrate. The present invention also provides an electronic device having the housing, and a method of making the housing.

An antenna structure includes a first carrier, a second carrier and an antenna main body. The antenna main body includes a main antenna and a sub antenna. The main antenna is printed on the first carrier, the sub antenna is printed on the second carrier. The present invention also provides a wireless communication device using the antenna structure.

Antenna structure and wireless communication device using the same

A display device includes a display, a receiving member, and a buffer member. The receiving member includes a peripheral wall. The buffer member is attached to the receiving member. The display is received in an interior of the peripheral wall of the receiving member and the buffer member is positioned at an exterior of the peripheral wall of the receiving member.

Growing community of inventors

Shenzhen, China

Xiao-Kai Liu