Dexcom, Inc.

Mc10, Inc.

Verily Life Sciences LLC

Xianyan Wang

Arthur M Lin

Pey-Jiun Ko

Timothy D Stowe

Milan S Raj

Bryan Keen

Ohseung Kwon

Roozbeh Ghaffari

Hoi-Cheong Steve Sun

Jonathan Grossman

Stephen P Lee

Nicholas McMahon

Jeffrey B Model

Bryan McGrane

David Lari

Brian Murphy

Valerie Susan Hanson

Brian Elolampi

Cindy Au

Briana Morey

David G Garlock

Monica Lin

Jon Echt

PingHung Wei

A body-mountable monitoring device includes a sensing device, a carrier body removably coupled to the sensing device, and an adhesive sheet bonded to the carrier body and configured to couple the carrier body to a user's skin, where the carrier body surrounds sidewalls of the sensing device such that at least a top surface is exposed when the sensing device is coupled to the carrier body.

Replaceable carrier for wearable devices

A implantable neural electrode assembly is described. The implantable neural electrode assembly includes a plurality of open-ended rings alternatingly connected to a spine. An inner layer of the open-ended rings is formed from a drug-loaded material (e.g., silicone that has been loaded with a steroid) and an outer layer is formed from a drug-free material. One or more electrode assemblies are connected to the inner layer and oriented towards a center of a cylinder defined by the plurality of open-ended rings.

Bi-layered neural interface with nerve-facing drug eluting structure

Examples of invasive biosensor alignment and retention features and methods are described. One example biosensor includes a housing comprising: a first surface defining a first opening, and a second surface opposite the first surface, the second surface defining a second opening, the first and second openings defining a substantially unobstructed pathway through the housing; a biosensor wire partially disposed within the housing and having an exterior portion extending through the first opening; a hollow insertion needle positioned within the pathway and extending through the first opening, the hollow insertion needle at least partially encircling the biosensor wire; and a biosensor retention feature collapsible against the first surface of the housing, the biosensor retention feature encircling and contacting the hollow insertion needle.

Invasive biosensor alignment and retention

In some aspects, an apparatus for a biosensor includes a sensor wire and a rigid member. The rigid member may be coupled to the sensor wire and include a contact surface. The contact surface may be sized to enable a suction head of a robotic placement device to create a vacuum seal on the contact surface for lifting the sensor wire and rigid member.

Wire-assembly apparatus for invasive biosensors

Wearable heat flux devices are disclosed that can detect heat flux based on evaporative cooling for determining a core body temperature of a user, and that can heat or cool a surface of a user for reaching a steady-state heat flux to determine the core body temperature of the user. Exemplary heat flux devices can include a heat flux sensor and a wicking layer. The heat flux sensor can be configured to detect heat flux at a location on a user. The wicking layer can be configured to absorb moisture at the location and to transport the moisture above the heat flux sensor. The heat flux subsequently detected by the heat flux sensor includes the evaporative cooling from the evaporation of the moisture.

Wearable heat flux devices and methods of use

A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.

Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

Encapsulated conformal electronic systems and devices, and methods of making and using the same

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San Jose, CA, United States of America

Xianyan Wang