Peking University

Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd.

Founder Information Industry Holdings Co., Ltd.

Xianren Chen

Baowei Ren

Shiqing Huang

Jinhong Li

A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (); forming a metal layer () with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion.

Manufacturing method for back drilling hole in PCB and PCB

A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according to positions of the back-drilled holes during a process of forming the PCB, wherein each of the formed metal rings has an outer diameter greater than an aperture of each of the back-drilled holes; forming, at positions corresponding to the positions of the back-drilled holes, metal holes extending through an outer layer of the PCB and the formed metal rings; forming two first detection holes electrically connected with the formed metal rings; forming the back-drilling holes on the PCB, which extend through and expand the metal holes; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled holes and the metal holes.

Growing community of inventors

Zhuhai, China

Xianren Chen