Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Xianjiang Xiong

Jiewei Li

Chuan Yin

Yong Cui

Dandan Zang

Yachao Tong

Litao Qu

Chia Hao Chang

Zhongsheng Qi

An organic light-emitting diode (OLED) substrate includes: a base substrate including a display region having a plurality of luminous regions and a non-luminous region separating one or more adjacent luminous regions, the non-luminous region including a plurality of first connection regions; a first electrode layer over the base substrate including a plurality of first electrodes having their projections on the base substrate cover the plurality of luminous regions; a pixel defining layer over the first electrode layer and located at the non-luminous region and defining the plurality of luminous regions, the pixel defining layer is hollowed out at the first connection regions; an electroluminescent functional layer provided over the pixel defining layer; a second electrode layer over the electroluminescent functional layer; and a plurality of conductive structures located at the plurality of first connection regions respectively, and electrically coupled to the second electrode layer.

OLED substrate and OLED display apparatus

There is provided a metal encapsulation structure and a production method thereof, an encapsulation method for a display panel, and a display device. This production method comprises steps of: providing a metal film having a first surface and a second surface opposite to the first surface; forming a silane film on the first surface of the metal film, wherein a surface of the silane film away from the metal film has an active group; and attaching the first surface formed with the silane film to an adhesive layer, so as to react and bond the active group and the adhesive layer.

Metal encapsulation structure and production method, display panel and encapsulation method thereof, and display device

The present disclosure provides a display substrate and a display device. The display substrate comprises a base substrate and an anode, an organic light-emitting layer and a cathode formed on the base substrate sequentially, wherein the display substrate further comprises a plurality of functional patterns formed between the organic light-emitting layer and the anode, the plurality of functional patterns is divided into different types based on colors of a plurality of sub-pixels, and each type of the plurality of functional patterns is disposed in a region of the sub-pixel with a color corresponding to the type; the plurality of sub-pixels with different colors has different driving voltages, and a resistance value of each type of the plurality of the functional patterns in a direction perpendicular to the organic light-emitting layer is controlled to decrease as the driving voltage of the sub-pixel with the color corresponding to the type increases.

Display substrate and display device

A display panel and a manufacturing method thereof. The display panel includes a base substrate, and a pixel area and a non-pixel area on the substrate. The pixel area includes a light emitting element, the light emitting element including a first electrode, a light emitting layer, and a second electrode which are sequentially on the base substrate; the non-pixel area includes a first structural area, the first structural area including a conductive supporting block on one side of the light emitting layer close to the base substrate; the display panel further includes an electric connection layer which is on one side, which is away from the base substrate, of the light emitting element and the first structural area; the second electrode of the light emitting element is electrically connected with the electric connection layer, and is electrically connected with the conductive supporting block through the electric connection layer.

Display panel and manufacturing method thereof

The present disclosure provides a packaging adhesive, a packaging method, a display panel, and a display device. The packaging adhesive includes a frit, an organic solvent, and a material with a thermal expansion coefficient larger than that of the frit. Using the packaging adhesive provided by the present disclosure, the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced by doping the material with a thermal expansion coefficient larger than that of the frit into existing glass cement, so that in a packaging process using laser radiation, an expansion volume of the packaging adhesive when heated is increased. In this way, a gap between the packaging adhesive and an array substrate is effectively reduced, and a packaging effect is improved.

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Beijing, China

Xianjiang Xiong