Southeast University

Beijing Baidu Netcom Science and Technology Co., Ltd.

Xiangyu Hou

Hui Zhang

Longxing Shi

Weifeng Sun

Siyang Liu

Long Zhang

Jie Ma

Yong Gu

Xuanjun Wang

A conductive channel structure for SiC devices, a fully integrated SiC device and a fully integrated manufacturing process thereof are provided. The fully integrated SiC device features a low-voltage region, a first high-voltage region and a second high-voltage region separated by isolation structures on the same SiC-based chip, and integrates first and second conductivity type MOS devices. The first and second conductivity type devices employ first and second conductivity type conductive channels respectively with alternating N-type and P-type first or second conductivity type areas above them. The manufacturing process includes sequentially stacking a second conductivity type epitaxial layer and buffer layer on an N-type substrate; and within the second conductivity type buffer layer, arranging first conductivity type well regions, heavily doped regions, channel regions, second conductivity type well regions, isolation structures, heavily doped regions, and channel regions.

Conductive channel structure for SiC devices, fully integrated SiC device and fully integrated manufacturing process thereof

Growing community of inventors

Nanjing, China

Xiangyu Hou