Contemporary Amperex Technology Co., Ltd.

Contemporary Amperex Technology Limited

Xiangqiang Huang

Tiefeng Wu

Tao Zhang

Nengwu Liao

Shaojun Qiu

Yuhuai Yang

Ruchu Yu

Zhiyong Deng

Yinyong Qiao

A die-cutting device includes a conveying mechanism configured to convey an electrode plate including uncoated and coated regions connected to each other, a cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region to form a scrap portion and a tab connected to the coated region, a first limiting member located between the electrode plate and the cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light from the cutting mechanism to pass through and matches a cutting trajectory of the laser light, and a second limiting member located on a side of the electrode plate facing away from the first limiting member in the thickness direction and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction.

Die-cutting device

An electrode plate processing device is provided. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Electrode plate processing device

The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.

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Ningde, China

Xiangqiang Huang