Elite Electronic Material (zhongshan) Co., Ltd.

Xiangnan Li

Chen-Yu Hsieh

Zhilong Hu

Changyuan Li

Lianhui Cai

Hao Chen

Teng Xu

Hezong Zhang

Shuwen Liu

Cheng Li

Hongxia Peng

Bangjun Lan

A phenylvinylsilane-divinylbenzene-styrene terpolymer is prepared by copolymerizing 50 parts by weight to 70 parts by weight of phenylvinylsilane, 10 parts by weight to 20 parts by weight of divinylbenzene and 20 parts by weight to 30 parts by weight of styrene, the total amount of phenylvinylsilane, divinylbenzene and styrene being 100 parts by weight, wherein the phenylvinylsilane has a structure of Formula (I) or Formula (II). Moreover, a resin composition includes a phenylvinylsilane-divinylbenzene-styrene terpolymer and a vinyl group-containing polyphenylene ether resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Copolymer, method of preparing the same, resin composition and article made therefrom

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

Resin composition and article made therefrom

The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).  In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a composite material having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and a laminate and printed circuit board having the properties of high glass transition temperature, low dielectric properties, halogen-free flame retardancy, low thermal expansion coefficient of the laminate, etc., can be made from the composite material.

Low dielectric composite material and laminate and printed circuit board thereof

The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).  In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.

Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof

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Zhongshan, China

Xiangnan Li