Boe Technology Group Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Huawei Technologies Co., Limited

Xiangming Meng

Lei Zhang

Yiqun Wu

Yan Chen

Jin Hu

Hongwei Xing

Zhuyi Luo

Hequn Zhang

Jianqiang Guo

Honglin Liao

Changkai Jie

Yifeng Li

Jinho Youn

Alireza Bayesteh

The present disclosure relates to a chamber cleaning apparatus and a control method thereof. The chamber cleaning apparatus comprises: a controller for providing control signals, a supplying device, and a cleaning rail provided within the chamber. The supplying device has a first working position and a second working position, the first working position corresponding to a conveyance entrance, and the second working position corresponding to a conveyance outlet; the supplying device comprises at least two scrolls, and cleaning cloth partly on the cleaning rail; the scroll at the first working position is connected to one end of the cleaning cloth, for conveying the cleaning cloth from the conveyance entrance to the cleaning rail, and the scroll at the second working position is connected to the other end of the cleaning cloth, for collecting the cleaning cloth passing through the conveyance outlet.

Chamber cleaning apparatus and control method thereof

A method of patterning a thin film is provided. The method includes coating a thin film layer and photoresist on a surface of a substrate; forming a first partially cured zone by performing a first exposing process of the photoresist with a mask, wherein exposing energy applied to the photoresist of the first partially cured zone is less than a photosensitive threshold of the photoresist; forming a cured zone on the first partially cured zone by performing a second exposing process of the photoresist with the mask, wherein a width of the cured zone is less than a width of the first partially cured zone, and exposing energy applied to the photoresist of the cured zone is equal to or greater than the photosensitive threshold of the photoresist; developing the photoresist; etching the thin film layer that is not covered by the photoresist; and removing the photoresist of the cured zone.

Method of patterning thin films

A method for correcting an exposure pattern on a substrate includes obtaining, based on the exposure pattern, displacement adjustment parameters for adjusting displacements of a worktable supporting the substrate in each of a first direction and a second direction, a rotation angle adjustment parameter for adjusting a rotation angle of the worktable in a rotation direction, and a gap adjustment parameter for adjusting a gap between the worktable and a mask plate. The first direction and the second direction are perpendicular to each other in a horizontal plane. The rotation direction is a direction in which the worktable rotates around a central axis of a base table supporting the mask plate. The method further includes moving the worktable based on the displacement adjustment parameters, the rotation angle adjustment parameter and the gap adjustment parameter.

Method and apparatus for exposure pattern correction and exposure system

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Beijing, China

Xiangming Meng