Dow Silicones Corporation

Ddp Specialty Electronic Materials US 9, LLC

Xianghuai Wang

Xiaobing Zhou

Brian David Rekken

Byung Keun Hwang

Noel Mower Chang

Vasgen Aram Shamamian

Junying Liu

A dual curable organopolysiloxane composition is disclosed. The composition comprises: (A) a first organopolysiloxane having at least two mercapto (—SH) functional groups per molecule and free of an alkenyl group; (B) a second organopolysiloxane having at least one alkenyl group and at least one silicon atom-bonded alkoxy group per molecule; (C) optionally an organopolysiloxane having at least two alkenyl groups per molecule and free of silicon atom-bonded alkoxy group; (D) a photo-initiator; (E) a condensation catalyst; and (F) an epoxy functional compound. The composition has the ability to both photo-cure and cure through exposure to moisture, and exhibits good to excellent curability and long-term storage stability.

Dual curable organopolysiloxane composition

A method of forming a film on a substrate is disclosed. The method comprises: heating a thiodisilane according to formula (I) (RRRCS)(RN)(Si&#x2014;Si)XH(I) in a chemical vapor deposition (CVD) or atomic layer deposition (ALD) process under thermal or plasma conditions to give a silicon-containing film disposed on the substrate, wherein: subscript s, n, x, h and R, R, R, R, and X are as described herein.

Thio(di)silanes

Thio(di)silanes comprising a thiosilane of formula (A): (RRRCS)(Si)XH(A) wherein subscript s is from 2 to 4 or a thiodisilane of formula (I): (RRRCS)(RN)(Si&#x2014;Si)XH(I) wherein subscript s is from 1 to 6, and wherein R, R, R, R, X and subscripts n, x and h are defined herein. Also compositions comprising same, methods of making and using same, intermediates useful in synthesis of same, films and materials prepared therefrom.

Growing community of inventors

Midland, MI, United States of America

Xianghuai Wang