Wuhan Telecommunication Devices Company

Accelink Technologies Co., Ltd.

Xianghong Yu

Di Zhang

Liping Sun

Weidong Ma

Yongan Fu

Baiquan Hu

Xuerui Liang

Liang Zhou

Jun Zhang

Chenggang Liu

Ben Chen

Tao Yuan

Fanrong Gao

Xuguang Chen

Long Chen

Xiaoge Cao

A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.

Planar optical waveguide structure, and coupling structure thereof and coupling method thereof

The present disclosure relates to an optical module having digital diagnostic monitoring functions and a circuit and method to control the optical module. In an embodiment, a control circuit for an optical module including an optical receiving unit and an optical transmitting unit may comprise a first memory for storing a plurality of configuration parameters at predefined locations within the first memory, a second memory for storing a plurality of variables at dynamically allocated locations of the second memory, the plurality of variables including variables corresponding to a current operation status of the optical module, and an analog-to-digital converter configured to receive an analog signal corresponding to the current operation status and convert the analog signal to a digital value to be stored as the variable corresponding to the current operation status in the dynamically allocated location of the second memory.

Optical module and circuit and method to control the same

Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (), wherein the surface of the silicon substrate () is provided with a platform (), lug bosses () and a groove (); a silica waveguide element () is arranged in the groove (), the lug bosses () are protruded from the surface of the platform (), and the surface of the platform () is provided with a discontinuous metal electrode layer (); and the surface of the metal electrode layer () is provided with solder bumps (), and an active optoelectronic chip () is arranged above the solder bumps () and the lug bosses (). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas () is manufactured between the alignment lug bosses (). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.

Silica-on-silicon-based hybrid integrated optoelectronic chip and manufacturing method therefor

An in-application upgrade method is used for optical module firmware not breaking a service. A storage area for internal programs of an optical module is divided into two areas which are respectively used for storing upgrade and application programs, and is divided into an area for backing up an interrupt vector table of a Boot program. An upper computer is in communication with the optical module. The interrupt vector table is switched, and the jump between the Boot program and the application program is achieved. The method includes extracting the contents of firmware, entering a download mode and updating the firmware. The original firmware is erased, and new firmware is written. An application mode is entered, the upper computer sending an exit command from the download mode. The upgrade program exits and a new application program is executed. The optical module operates normally without interruption.

In-application upgrade method for optical module firmware not breaking service

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Hubei, China

Xianghong Yu