Lightwaves 2020, Inc.

Jds Uniphase Corporation

Other

Lumentum Operations LLC

Xiangdong Qiu

Jing-Jong J Pan

Prasad Yalamanchili

Kejian Guan

Reddy Raju

Mingjie Zhang

Jay A Skidmore

Richard L Duesterberg

Gordon Cook Wilson

Michael Y Au

Jihua Du

Hai-Ming Wu

Laura Zavala

YuZhong Dai

Gordon Wilson

A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Light emitting semiconductor device

A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Semiconductor device assembly

A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

Optical module with fiber feedthrough

An apparatus for coupling radiation of individual laser diode emitters into a common optical fiber is disclosed. The radiation is collimated along fast axis and combined by using crossed pairs of flat mirrors. The combined beams are collimated by a common slow axis collimating lens. The laser diode emitters are disposed on both sides of an optical axis of the slow axis collimating lens such that the optical path lengths from the emitters to the slow axis collimating lens are equal.

Light source

An EDFA with integrated input and output modules is presented. The integrated input module has a packaged pump laser diode mounted to the metal EDFA package to provide a heat sink for the pump laser diode which sends the pump laser light over a optical fiber section connected to the amplifying erbium-doped optical fiber section. The fiber section is formed from an optical fiber which better matches the transmission modes in the erbium-doped optical fiber section and has an end subsection of the single mode fiber for a larger numerical aperture. Collimating lenses also increase the coupling efficiency of the laser diode to the erbium-doped fiber section. The integrated output module has a photodiode with a tap filter to monitor the output power of the EDFA, an optical isolator to prevent interference in the erbium-doped optical fiber section. With a twin optical isolator, the integrated input and output modules can be arranged in different ways and combinations with the erbium-doped optical fiber section. The resulting EDFAs can be manufactured relatively inexpensively into an very small packages compared to current EDFA packages.

Erbium-doped fiber amplifier and integrated module components

Erbium-doped fiber amplifier and integrated circuit module components

A temperature compensation circuit arrangement for liquid crystal cells in optical devices is presented. In an optical device, a liquid crystal cell typically manipulates the optical signals according to an output optical property, such as attenuation, responsive to an AC voltage source electrical signal. A feedback circuit arrangement is connected to the liquid crystal cell and controls the current through the liquid crystal cell with respect to temperature by a predetermined control equations for the output optical property so that the device manipulates the optical signals independently of temperature. The current follows the control equations, which are empirically determined with respect to temperature for one equation.

Temperature compensation for liquid crystal cell optical devices

Growing community of inventors

Cupertino, CA, United States of America

Xiangdong Qiu