Intel Corporation

Apple Inc.

Xiang Li

George Vergis

Jun Liao

Hao-Han Hsu

Kai Xiao

James A McCall

Phil Geng

Kuan-Yu Chen

Jaejin Lee

Yun Ling

Mani Prakash

Chung-Hao Chen

Yunhui Chu

Jingbo Li

Zhichao Zhang

Christopher E Cox

Zhen Zhou

Jong-Ru Guo

John M Lynch

Konika Ganguly

Mo Liu

Zuoguo Wu

Casey R Winkel

Daqiao Du

Guixiang Tan

Shaohua Li

Jackson Chung Peng Kong

Kemal Aygun

Zhiguo Qian

Sanka Ganesan

Jiangqi He

Ram S Viswanath

Rajasekaran Swaminathan

Howard L Heck

Jeffory L Smalley

Michael W Leddige

Donald Tiendung Tran

Dimitrios Ziakas

Bassam N Coury

Xiaoning Ye

Kuang C Liu

David J Llapitan

Gregorio R Murtagian

Douglas Heymann

Chong J Zhao

Stephen H Hall, Jr

Gong Ouyang

Jonathan W Thibado

Jeffrey Krieger

Charles C Phares

Tolga Memioglu

Anthony M Constantine

Rebecca Z Loop

Mohd Muhaiyiddin Bin Abdullah

Kai Wang

Tae-Young Yang

Lu-Vong T Phan

Thomas T Holden

Shyamjith Mohan

Beomtaek Lee

Ling Zheng

Qin Li

Raul Enriquez-Shibayama

Chong Richard Zhao

Yuanhong Zhao

Kevin Stone

Slobodan Mrdjan

Wei Xu

Kuan-yu Chen

Brian P Moran

In one embodiment, a card edge connector includes a housing including a slot to receive a first circuit board. A first plurality of pins extend from within the slot through a bottom of the housing. Each of the first plurality of pins includes a first end to mate with a corresponding contact of the first circuit board and a second end to mate with a corresponding one of a first plurality of contacts of a second circuit board, the second end including a heel portion and a toe portion extending from the heel portion in a direction away from a centerline of the slot. A second plurality of pins extend from within the slot through the bottom of the housing. Each of the second plurality of pins includes a first end to mate with a corresponding contact of the first circuit board and a second end to mate with a corresponding one of a second plurality of contacts of the second circuit board, the second end comprising a heel portion and a toe portion extending from the heel portion in a direction toward the centerline of the slot. Other embodiments are described and claimed.

Card edge connector including a flipped pin foot orientation

Examples described herein relate to an apparatus comprising: a trace comprising a portion routed at least 180 degrees around a perimeter of a pad, wherein the portion is coupled to the pad. In some examples, wherein a cross-sectional shape of the portion routed at least 180 degrees around a perimeter of the pad is one or a combination of: circular, elliptical, square, rectangle, or triangular. In some examples, wherein the portion routed at least 180 degrees around a perimeter of the pad is to increase package inductance and reduce a magnitude of far end cross talk (FEXT). In some examples, wherein the portion routed at least 180 degrees around a perimeter of the pad comprises one or more of: copper, bronze, or an alloy.

Signal trace configuration to reduce cross talk

A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The grounded molding includes an electrically conductive epoxy mold to cover the memory die, where the electrical conductivity of the molding, with the molding grounded can provide radio frequency interference (RFI) shielding.

Memory device package with noise shielding

In one embodiment, a card edge connector includes: a housing having an opening into which a first circuit board is to be inserted; a plurality of pins each having a first end and a second end, the plurality of pins extending from within the opening through a bottom surface of the housing, the first end of the first plurality of pins to mate with a corresponding contact of the first circuit board; and a plurality of ball grid array (BGA) solder balls each adapted at the second end of a corresponding one of the plurality of pins, the plurality of pins to mate with a corresponding conductive area of a second circuit board to which the card edge connector mates via the plurality of BGA solder balls. Other embodiments are described and claimed.

Ball grid array card edge connector

A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever coupled to the load member via a second pivot point, and a spring to bias the load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading.

DIMM retention assembly for compression mount technology and land grid array connector loading

An apparatus is described. The apparatus includes a DIMM socket having a seating floor that is to meet both longer length contacts and shorter length contacts of a DIMM when the DIMM is fully seated in the socket.

DIMM socket with seating floor to meet both longer length edge contacts and shorter length edge contacts

An apparatus is described. The apparatus includes a dual-in line memory module (DIMM) socket having a first latch and a second latch. One of the first latch and the second latch having a feature for a user to apply force to release a DIMM from the DIMM socket. The other of the first latch and the second latch not having a feature for the user to apply force so that one end of the DIMM releases before an opposite end of the DIMM during release of the DIMM from the DIMM socket.

Dual in-line memory module (DIMM) socket that prevents improper DIMM release

A connector includes connector pins that have a loop of conductor. The connector connects a first printed circuit board (PCB) to a second PCB with compression of the connector pins between the two boards. In response to compression of the connector, the connector pins make electrical contact with themselves through the loop, while also connecting pads of the first PCB to pads of the second PCB.

Closed loop compressed connector pin

Connectors with a hybrid pitch are described. In one example, a connector to couple a card or module to a motherboard includes connector housing and a plurality of pins. The plurality of pins include alternating signal and ground pins. Each of the plurality of pins includes a card or module-facing end to couple with the card or module and a lead to couple with a through hole in the motherboard. A first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin.

Hybrid pitch through hole connector

Examples described herein relate to a pin arrangement that includes a first signal pin; a second signal pin; and multiple parallel ground pins positioned between the first and second signal pins. In some examples, the multiple parallel ground pins are coupled to a single pin connector coupled to a first device and a single pin connector coupled to a second device. In some examples, a first leg of the multiple parallel ground pins is positioned parallel to a portion of the first signal pin and wherein a second leg of the multiple parallel ground pins is positioned parallel to a portion of the second signal pin. In some examples, the multiple parallel ground pins provide a 1:N signal to ground ratio for signals transmitted through at least a portion of the first and second signal pins, where N is greater than 1.

Device-to-device connection with multiple parallel ground pins

An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Reduced vertical profile ejector for liquid cooled modules

Connectors with a staggered pin orientation can reduce crosstalk amongst signal pins. In one example, a connector to couple a card or module to a motherboard includes connector housing and a plurality of pins. Each of the plurality of pins includes two ends including a card or module-facing end to couple with the card or module and a motherboard-facing end to couple with the motherboard. Each of the plurality of pins includes a middle section in the connector housing. One or both of the ends include one or more bends relative to the middle section. The plurality of pins includes alternating signal pins and ground pins, wherein the signal pins having an opposite orientation relative to the ground pins.

Connector with staggered pin orientation

An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.

Retention latch with spring mechanism

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

Connector retention mechanism for improved structural reliability

An apparatus is described. The apparatus includes a dual-in line memory module (DIMM) socket having a first electrical circuit component embedded in a latch of the DIMM socket. The first electrical circuit component has a first exposed electrical contact that is to contact or not contact a second exposed electrical contact of a second electrical circuit component that is embedded in a housing of the socket depending on whether a corner of a DIMM is or is not properly inserted into the DIMM socket.

Dual in-line memory module (DIMM) socket circuit to detect improper insertion of a DIMM edge into a DIMM socket

Growing community of inventors

Portland, OR, United States of America

Xiang Li