Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Xian-Xiu Tang

Zhen-Xing Ye

Chia-Shin Chou

Ning Li

Xian-Guang Tan

A chassis includes a base, a number of fans mounted in the base, and an air guiding member. The base includes a bottom wall and a sidewall perpendicularly connected to a side of the bottom wall. The fans are mounted on the bottom wall. The air guiding member includes a fixing portion slidably mounted to the sidewall and a guiding portion pivotably connected to the fixing portion. The guiding portion is pivotable to adjust the direction of airflow from the fans.

Chassis with air guiding member

In a method for adjusting a fan of an electronic device, a sensor of the electronic device detects an instant work environment temperature of an electronic component of the electronic device. The detected temperature is obtained from the sensor. The speed of the fan under the detected temperature and a speed of the fan to which it may be adjusted is computed using a predefined algorithm based on prestored values, obtained from experimentation. The fan is adjusted to achieve a heat dissipation mode and an energy-saving mode of the electronic device accordingly.

Electronic device and method for adjusting fan of electronic device

A heat dissipation device includes a heat absorbing member, a number of fins mounted on the heat absorbing member, a first connecting pipe, and a second connecting pipe. A top surface of the heat absorbing member defines a serpentine slot. The slot includes an inlet hole and an outlet hole communicating with two opposite ends of the slot and extending through the heat absorbing member. The first connecting pipe is connected to the inlet hole of the heat absorbing member, and the second pipe is connected to the outlet hole of the heat absorbing member.

Heat dissipation system and rack-mount server using the same

An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis.

Heat dissipation apparatus and electronic device using the same

A water tank includes a box, an air valve body, a valve core, a cap, and an elastic element. The box defines an accommodating space and a vent communicating with the accommodating space. The air valve body is extended out from the box and adjacent to the vent. The valve core is mounted to the valve body to airproof the vent, and comprises a first end inserted into the accommodating space through the vent and a second end opposite to the first end. The elastic element is arranged between the cap and the valve core. The valve core will open the vent to deform the elastic member and allow heated air in the accommodating space to leak out of the accommodating space through the vent, in response to an air pressure in the box is greater a reference air pressure.

Water tank of water-cooled heat dissipation system

An electronic device includes a server unit, a storage apparatus, and a heat dissipation apparatus. The server unit includes a bottom plate defining a first air inlet. The heat dissipation apparatus includes an exhaust fan located above the bottom plate and an air adjusting member. The exhaust fan includes a second air inlet aligning with the first air inlet. The adjusting member is slidably located between the first air inlet and the second air inlet. The bottom plate and the storage apparatus cooperatively bound an airflow channel communicating with the first air inlet. The second air inlet is partitioned into a first air inlet communicating with the airflow channel and a second air inlet communicating with the server unit by the air adjusting member. The air adjusting member is operated to slide to change sizes of the first air inlet and the second air inlet.

Electronic device with heat dissipation apparatus

A heat dissipation system includes a chassis, a number of heat absorbing boxes, a number of pipes, a first water tank and a second water tank received in the chassis, a number of fins sandwiched between the first water tank and the second water tank, a number of fans aligning with the fins, and a water pump connected between the first water tank and the second water tank. Each heat absorbing box includes a water inlet and a water outlet, and heat from electrical components is gathered by the boxes, transferred to the water tanks, and the fans blow air through the fins to dissipate the gathered heat.

A computer enclosure includes a sidewall and a fan mounting apparatus. The sidewall defines a ventilation area and four slide slots around the ventilation area. The fan mounting apparatus includes two opposite first position member, and two opposite second position members alternately arranged with the first position members. The first and second position members are slidably connected end to end and cooperatively define a ring. The first and second position plates are moved toward or away from each other. The first and second position members are slidably and respectively connected to the slide slots, to decrease or increase a diameter of the ring for selectively mounting different sized fans.

Computer enclosure and fan mounting apparatus

A mounting apparatus includes a case. The case includes a first bracket and a second bracket. The first bracket defines a space. The second bracket is configured for securing a fan and is connected with the first bracket. The second bracket has a volume equal to or less than the volume of the first bracket space.

Mounting apparatus for fan

A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Computer casing having liquid cooling unit

Water-cooled heat dissipation system and water tank thereof

A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Fixing device for fixing fans and cooling system having same

An exemplary mounting structure is adapted for supporting an apparatus of a computer. The mounting structure includes a securing bracket and a connecting bracket. The connecting bracket is mounted on the securing bracket and is slidable along a first axis relative to the securing bracket. The connecting bracket is adapted for supporting the apparatus thereon. The apparatus is slidable along a second axis relative to the connecting bracket.

Mounting structure of computer

A heat conductive member is connected to a heat-generating electronic component. A liquid tank defines a liquid injection hole. A clip assembly is connected to the liquid tank. When pressed against the clip assembly, the liquid tank is fastened by the clip assembly and retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. The liquid tank includes a tube portion and a rotation wheel. The tube portion includes a hollow tube and a positioning portion formed along a sidewall at a first end of the tube. The rotation wheel is fixed on the positioning portion and adjacent to the sidewall. The blades of the rotation wheel oppose the hollow of the tube. A second end of the tube is connected to the conduits.

Liquid cooling system

A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a centrifugal fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second channel includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe.

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Shenzhen, China

Xian-Xiu Tang