Agency for Science, Technology and Research

Xian Tong Chen

Guo-Qiang Patrick Lo

Tai Chong Chai

Xiaowu Zhang

Shi Yang Zhu

Alastair David Trigg

Shao Hua Tao

Cheng Kuo Cheng

Cheryl Sharmani Selvanayagam

Kripesh Vaidyanathan

A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.

Bonding stress testing arrangement and method of determining stress

An embodiment of the invention relates to an optical resonator. The optical resonator includes an input optical waveguide and a closed loop coupled to the input optical waveguide. The closed loop is adapted to receive light from the input optical waveguide, wherein the closed loop includes at least one hole formed within a portion of the closed loop.

Optical resonator and optical sensing system comprising the same

Growing community of inventors

Singapore, Singapore

Xian Tong Chen