Tpk Advanced Solutions Inc.

Xian Bin Xu

Xiong Min Zhang

Ming Qiang Fu

Shi Yuan Lian

Chen-Hsin Chang

Lien-Hsin Lee

Chia Jui Lin

Shao Jie Liu

Chen Hsin Chang

Chun Yan Wu

Ming Hsien Ko

Xue Long Zhang

Po-Pin Hung

Qing Hui Lu

Yong Bin Ke

Yong Hui Huang

Xue Fen Wang

Wei Chou Chen

Sheng Fa Liu

Po Yu Hsiao

Ya Chin Chang

Yi Lung Yang

Ming Chung Liu

Bao Huang Chen

A touch display module includes a touch device and a polarizing element. The polarizing element includes a polarizer and a retardation film assembly. The retardation film assembly has a polarization ellipticity value (e-value), and the absolute value of the e-value is greater than 0.8. A reflection rate of the polarizing element is less than 6%, and a total reflection rate of the touch device and the polarizing element is less than 7%.

Touch display module

A bonding structure includes a substrate, a first sensing electrode layer, a second sensing electrode layer, an optical film layer, and a protective layer. The substrate has opposite first and second surfaces. A sensing area and a bonding area are defined on the substrate. The first sensing electrode layer is disposed on the first surface. The second sensing electrode layer is disposed on the second surface. The optical film layer covers the first sensing electrode layer and has a first bonding opening located in the bonding area. The protective layer covers the second sensing electrode layer and has a second bonding opening located in the bonding area. The first and second bonding openings respectively expose a part of the first sensing electrode layer and a part of the second sensing electrode layer and are misaligned in a direction perpendicular to the first or second surface.

Bonding structure and electronic device

A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.

Cover plate used in electronic device, electronic device, and method of manufacturing cover plate

An electronic device includes a substrate, a polarizer, a flexible printed circuit board, a first transparent glue layer, a first colloid, and a second colloid. The substrate includes a first side and a second side. The first side is opposite to the second side. The polarizer is disposed on the first side of the substrate. The flexible printed circuit board is connected to the first side of the substrate with a conductive glue. A gap is formed between flexible circuit board and polarizer. The first transparent glue layer is disposed on the second side of substrate. The first colloid is configured to bond at least two of substrate, polarizer, or flexible printed circuit board. The second colloid is configured to bond at least two of the substrate, the flexible printed circuit board, or the first transparent glue layer. The first colloid is not in contact with the second colloid.

Electronic device

Growing community of inventors

Xiamen, China

Xian Bin Xu