University of California

General Engineering & Research LLC

Xia Xu

Sungho Jin

Renkun Chen

Robin Ihnfeldt

Eunjeong Kim

Jianlin Zheng

Elizabeth Caldwell

This invention relates to magnetocaloric materials comprising alloys useful for magnetic refrigeration applications. In some embodiments, the disclosed alloys may be Cerium, Neodymium, and/or Gadolinium based compositions that are fairly inexpensive, and in some cases exhibit only 2order magnetic phase transitions near their curie temperature, thus there are limited thermal and structural hysteresis losses. This makes these compositions attractive candidates for use in magnetic refrigeration applications. Surprisingly, the performance of the disclosed materials is similar or better to many of the known expensive rare-earth based magnetocaloric materials.

Magnetocaloric alloys useful for magnetic refrigeration applications

This invention relates to magnetocaloric materials comprising ternary alloys useful for magnetic refrigeration applications. The disclosed ternary alloys are Cerium, Neodymium, and/or Gadolinium based compositions that are fairly inexpensive, and in some cases exhibit only 2order magnetic phase transitions near their curie temperature, thus there are no thermal and structural hysteresis losses. This makes these compositions attractive candidates for use in magnetic refrigeration applications. The performance of the disclosed materials is similar or better to many of the known expensive rare-earth based magnetocaloric materials.

This invention relates to a cooling device which utilizes both thermoelectric and magnetocaloric mechanisms for enhanced cooling applications. Using high thermal conductivity magnetocaloric composites in conjunction with thermoelectric elements acting as thermal switches which are electrically coupled to a magnetization and demagnetization cycle enables the use of larger quantities of magnetocaloric material, and high efficiency solid state cooling can be achieved. Solid state cooling devices are useful for a variety of industrial applications which require cooling, such as, but not limited to cooling of microelectronic devices, cooling on space platforms, etc.

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Xia Xu