Delta Electronics, Inc.

Shanghai Phigine Medical Co. Ltd

Xi Liu

Haishan Wang

Qifeng Yu

Kun Jiang

Quansong Luo

Jianxin Chen

Geguo Men

Yanbing Xia

Yanggui Feng

Liang Jin

Yuncong Yang

Kaijian Yang

The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

Electronic module assembly structure

A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

Method for forming power module package, power module package and electronic device

The present disclosure discloses an impeller of a cardiac assist device, and the cardiac assist device. The impeller of the cardiac assist device includes an impeller shaft and a plurality of blades; a shape of the plurality of blades is set such that: blade cascades of the plurality of blades are of arc lines that recess towards a same side, and the blade cascade is a planar unfolding shape of an intersection line where a cylindrical surface intersects with the blade. In the present disclosure, a traditional wing-shaped blade cascade is changed, the blade cascades are of arc lines that recess towards the same side, this design enables blood to pass through the impeller at a smaller inflow angle and a greater outflow angle, the smaller inflow angle may generate a greater lift, so that the impeller obtains a greater output power, and meanwhile, a rotational flow can be prevented from being generated at an inflow port, such that the blood stably flows into the impeller. The greater outflow angle can convert the rotation energy of the blood at an outflow port into an axial kinetic energy, thereby obtaining a greater axial speed, and improving the efficiency of the impeller.

Impeller of cardiac assist device, and cardiac assist device

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Shanghai, China

Xi Liu