Koninklijke Philips Corporation N.v.

Xi Gu

Carsten Deppe

Gero Heusler

Hendrik Huisman

Ralf Gordon Conrads

The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers () for transmitting electrical current and at least one electrically insulating layer () comprising electrically insulating material, wherein the electrically conductive layers () and the electrically insulating layer () are arranged in an alternating assembly such that the two electrically conductive layers () are electrically insulated with respect to each other by means of the electrically insulating layer (), wherein each of the electrically conductive layers () is adapted to be coupled to a bond wire () independently from the other electrically conductive layer () at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

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Eindhoven, Netherlands

Xi Gu