Scp Global Technologies, Inc.

Applied Materials, Inc.

Wyland L Atkins

Jeffrey C Hudgens

Charles T Carlson

James S Papanu

Victor B Mimken

Martin C Bleck

Mike Rice

Penchala N Kankanala

Tom Krawzak

Eric T Hansen

John J Rosato

Scott Meyer

Douglas Richards

Josh Butler

R Mark Hall

Evanson G Baiya

Tamer Elsawy

Paul Lester

Constantin Predoaica

Rod Fladwood

J Ross Talley

The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Wet clean system design

A compliant door assembly for use in sealing an opening in a vessel bottom includes a door having a sealing wall, the sealing wall having a contact face moveable into contact with a wall surrounding the vessel bottom. A reinforcing member is moveable into contact with the back face of the sealing wall, thereby reinforcing sealing contact between the contact face and the wall surrounding the opening.

Dump door

A method for exposing an object to fluid using principles of the present invention includes the steps of introducing the object into a coanda flow forming passage and directing a coanda jet onto a coanda profile that surrounds the object to cause amplified flow to surround the object and move axially through the passage. An apparatus for exposing an object to fluid utilizing principles of the present invention includes a chamber having an enclosed coanda profile and a fluid inlet such as a coanda slot fluidly coupled to the passage. The passage is proportioned to receive an object to be treated. In one embodiment of the method and apparatus, fluid apertures for focusing an additional fluid onto the object may be positioned within the chamber, and a fluid may be directed from the apertures onto the object to clean the object before the object is dried using the amplified flow through the chamber.

Method and apparatus for washing and/or drying using a revolved coanda profile

A process vessel which may be utilized in wet processing of semiconductor wafers includes a tank having one or more fluid displacers attachable to the tank. The one or more fluid displacer(s) have position in which they extend into the interior of the tank. The fluid displacers may be carried by a lid moveable into a closed position covering the opening in the tank. Movement of the lid into the closed position causes the fluid displacers to extend into the tank.

Process vessel

Described herein is a chemical injection system and method utilizing a chemical storage vessel coupled to a bulk source of chemical and proportioned to contain a volume of chemical useful for multiple applications for which the chemical is to be utilized. A dispense vessel proportioned to contain a volume of chemical useful for a single application is fluidly coupled to the chemical storage vessel. A controller controls operation of a system of valves and sensors, which operate to fill the chemical storage vessel, and to precisely dispense the volume required for a single application from the storage vessel into the dispense vessel and then ultimately into the vessel in which the chemical is needed.

Chemical Dispensing system and method

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Kuna, ID, United States of America

Wyland L Atkins