Chartered Semiconductor Manufacturing Ltd (corporation)

Globalfoundries Singapore Pte. Ltd.

Wye Boon Loh

Alex See

Ting Cheong Ang

Sang Yee Loong

Jun Song

Chua Chee Tee

Cher Liang Randall Cha

Purakh Raj Verma

Shyue Fong Quek

Jeoung Mo Koo

Chit Hwei Ng

Beng Lye Oh

Paul Kim Cheong Soh

Shyuz Fong Quek

There is provided a method comprising receiving data corresponding to a layout design for a plurality of input mask layers and generating a layout design for at least one generated mask layer. The relationship between a first geometric element in a first layout pattern comprising one or more of the generated mask layers and a second geometric element in a second layout pattern is then determined and verified to check if they comply with predetermined rules. If the relationship does not conform with the predetermined rules the design of at least one of the generated mask layers associated with the first or second layout pattern is modified.

Methodology for performing post layer generation check

A process for forming a high dielectric constant, (High K), layer, for a metal-oxide-metal, capacitor structure, featuring localized oxidation of an underlying metal layer, performed at a temperature higher than the temperature experienced by surrounding structures, has been developed. A first iteration of this process features the use of a laser ablation procedure, performed to a local region of an underlying metal layer, in an oxidizing ambient. The laser ablation procedure creates the desired, high temperature, only at the laser spot, allowing a high K layer to be created at this temperature, while the surrounding structures on a semiconductor substrate, not directly exposed to the laser ablation procedure remain at lower temperatures. A second iteration features the exposure of specific regions of an underlying metal layer, to a UV, or to an I line exposure procedure, performed in an oxidizing ambient, with the regions of an underlying metal layer exposed to the UV or I line procedure, via clear regions in an overlying photolithographic plate. This procedure also results in the formation of a high K layer, on a top portion of the underlying metal layer.

Method of forming a high K metallic dielectric layer

A method for forming a capacitor in a semiconductor device. An embodiment simultaneously forms a MIM capacitor and a dual damascene interconnect using common process steps. An embodiment comprises: forming a capacitor bottom plate and a first metal line over the semiconductor structure. We form a second dielectric layer over the capacitor bottom plate, the first metal line, and a first dielectric layer. Next, we form a top plate opening in the second dielectric layer to at least partially expose the capacitor bottom plate. A capacitor dielectric layer is formed over the capacitor bottom plate and the second dielectric layer. A capacitor top plate is formed in the top plate opening. Subsequently, we form a via opening through at least the second dielectric layer, the capacitor dielectric layer over the first metal line to expose a portion of the first metal line. Next, we fill the via opening with a second metal layer to form a via plug. A third dielectric layer is formed over the via plug and the capacitor top plate. We form a first trench opening and a second trench opening through the third dielectric layer, the second passivation layer and the third passivation layer. The first trench opening exposes a portion of the capacitor top plate. The second trench opening exposes a portion of the via plug. Next, we form a first trench plug in first trench opening and a second trench plug is the second trench opening. The top plate, the capacitor dielectric and the bottom plate form a capacitor.

Method for an advanced MIM capacitor

Method of forming of high K metallic dielectric layer

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Singapore, Singapore

Wye Boon Loh