Other

Kingpak Technology Inc.

Wu Hsiang Lee

Nai Hua Yeh

Jichen Wu

Hsiu Wen Tu

Mon Nan Ho

Chen Pin Peng

Wen Chuan Chen

Li Huan Chen

Yung Sheng Chiu

Joe Liu

Yen Cheng Huang

Chief Lin

Yves Huang

Fu Yung Huang

Kuang Yu Fan

C S Cheng

Ren Long Kau

Chih Hsien Chung

May Chen

A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

Memory module structure

A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

Stacked package structure of image sensor

Growing community of inventors

Hsinchu Hsien, Taiwan

Wu Hsiang Lee