Dell Products Inc.

Wu Chin-Chung

Bradford Edward Vier

Chun-Kai Tzeng

Yong-Teng Lin

Priyank Gajiwala

Ching Wei Chang

Robert D Hrehor, Jr

Charles Dennis Hughes

Trevor R Todd

An information handling system with a wireless charging system or wireless antenna may include a processor; a memory; a power management unit (PMU), an antenna controller to provide instructions to a radio to cause an antenna to transceive wirelessly with a network, or a wireless charging controller to schedule the wireless charging at a charging coil, where the antenna or charging coil are part of a twice-molded modular antenna including: the antenna a charging coil, an antenna holder onto which the antenna is insert molded, and an antenna cover that is molded onto the antenna or charging coil for interference at an antenna window edge surface of a chassis cover of the information handling system.

System and method for reducing an antenna window size and enhancing a wireless charging efficiency and performance

An apparatus and method of manufacture for a modular seamless touchpad assembly comprising a seamless glass layer extending to a plurality of palm rest surfaces formed over a touchpad support bracket that extends across a top cover of a base chassis of an information handling system and including a touchpad printed circuit board assembly (PCBA) and a haptic actuator array coupled between the touchpad PCBA and the touchpad support bracket for generating haptic user feedback. The touchpad support bracket is formed under the haptic actuator array to support the modular seamless touchpad assembly as an installable hardware module to modularly fit within a touchpad opening formed in the top cover of the base chassis and a connector port to operatively couple a haptic touchpad controller with a reciprocal connector in the touchpad opening such that the modular seamless touchpad assembly is testable via the connector port before installation.

System and method of a modular seamless haptic touchpad assembly and method of manufacture of the modular seamless haptic touchpad

A touch panel device includes a face plate, a bracket, and a PCB. The face plate receives a contact. The bracket includes a permanent magnet affixed to a surface of the bracket. The PCB is positioned proximate to the bracket such that a surface of the PCB is adjacent to the bracket. The PCB includes a Hall sensor collocated proximate to the permanent magnet. The touch panel circuit is coupled to the Hall sensor. When the contact is received at the face plate, the PCB moves closer to the bracket. In response, the touch panel circuit receives a voltage from the Hall sensor, determines a force associated with the contact based upon the voltage, and triggers a haptic feedback response in the bracket.

Integrated force sensing method for haptic function

A touch panel device includes a face plate, a force-feedback device, and a touch panel circuit. The face plate receives at a first surface a contact with the face plate. The force-feedback device includes a PCB affixed by a first surface of the PCB to a second surface of the face plate. The PCB includes a first metallic ring on a second surface of the PCB. The piezo disc includes a piezoelectric wafer and a second metallic ring. The piezo disc is adjacent to the second surface of the PCB. The touch panel circuit is coupled to the first metallic ring, the second metallic ring, and the piezoelectric wafer. The touch panel circuit determines a capacitance between the first metallic ring and the second metallic ring, determines a force associated with the contact based upon the capacitance, and triggers a haptic feedback response in the piezoelectric wafer.

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Yonghe Dist., Taiwan

Wu Chin-Chung