Imec

Katholieke Universiteit Leuven

Interuniversitair Microelektronica Centrum (imec)

Wouter Ruythooren

Johan Das

Eric Beyne

Philippe Soussan

Caroline Whelan

Koen De Munck

Massimo Mastrangeli

The present invention is related to a method for aligning and bonding a first element () and a second element (), comprising:

Method for aligning and bonding elements and a device comprising aligned and bonded elements

A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid is disclosed. In one aspect, the chips are directed to target sites on the substrate within the first liquid. The target sites are covered with a second liquid. The second liquid and the first liquid are immiscible. The chips are attracting the first liquid. A predetermined surface is chosen or treated on each chip such that it is selectively attracted by the second liquid and attracting the first liquid.

Method for performing parallel stochastic assembly

The present invention is related to a method of producing a semiconductor device and the resulting device. The method is suitable in the first place for producing high power devices, such as High Electron Mobility Transistors (HEMT), in particular HEMT-devices with multiples source-gate-drain groups or multiple base bipolar transistors. According to the method, the interconnect between the source contacts is not produced by air bridge structures, but by etching vias through the semiconductor layer directly to the ohmic contacts and applying a contact layer on the backside of the device.

Semiconductor device having interconnected contact groups

Method for producing a semiconductor device and resulting device

Growing community of inventors

Tildonk, Belgium

Wouter Ruythooren