Siemens Medical Solutions Usa, Inc.

Acuson Corporation

Worth B Walters

Sevig Ayter

John P Mohr, Iii

Nelson H Oliver

Todor Sheljaskow

John Alexander Hossack

John W Sliwa, Jr

Vaughn R Marian

William John Park

Paul E Chandler

David A Petersen

Lewis Jones Thomas, Iii

Jing Liu

Gregg W Frey

Joan Carol Main

Timothy L Proulx

Xuan-Ming Lu

Kathy J Jackson

Walt T Wilser

Mirsaid S Boloforosh

A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.

Digital capacitive membrane transducer

In kmode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for kresonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a kmode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.

Multi-dimensional ultrasound transducer array

Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.

Electrically conductive matching layers and methods

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements include one or more of: (1) multiple-layer, multiple-dimensional arrays where the layers are polymericly bonded together and electrically connected through asperity contact, (2) multiple layer array of elements where air or gas separates at least two elements, (3) an even number of layers where each layer is electrically connected through asperity contact, (4) multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Multi-layered transducer array and method for bonding and isolating

An ultrasound transducer assembly is disclosed having a housing, a transducer array mounted in the housing and an electronics assembly mounted in the housing, the electronics assembly including one or more sub-assemblies having heat generating components disposed thereon. The electronics sub-assemblies further include thermal conducting features which conduct heat generated by the heat generating components out of the electronics assembly where it can be further removed by other thermal management techniques. These other thermal management techniques may include techniques utilized to cool the transducer array.

System and method for actively cooling transducer assembly electronics

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements are manufactured by one or more of: (1) stacking to form a multiple-layer, multiple-dimensional array where the layers are polymericly bonded and electrically connected through asperity contact, (2) using air or gas to separate at least two elements, (3) stacking an even number of layers where each layer is electrically connected through asperity contact, (4) using multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Method of manufacturing a multi-dimensional transducer array

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements include one or more of: (1) multiple-layer, multiple-dimensional arrays where the layers are polymericly bonded and electrically connected through asperity contact, (2) multiple layer array of elements where air or gas separates at least two elements, (3) an even number of layers where each layer is electrically connected through asperity contact, (4) multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Multi-layered transducer array and method having identical layers

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements include one or more of: (1) multiple-layer, multiple-dimensional arrays where the layers are electrically connected through asperity contact, (2) multiple layer array of elements where air or gas separates at least two elements, (3) an even number of layers polymerically bonded together where each layer is electrically connected through asperity contact, (4) multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Multi-dimensional transducer array and method with air separation

Transducer array using multi-layered elements and a method of manufacture thereof

Multiple layer elements for a transducer array are provided. Each element comprises two or more layers of transducer material. Various of the elements include one or more of: (1) multiple-layer, multiple-dimensional arrays where the layers are poymericly electrically connected through asperity contact, (2) multiple layer array of elements where air or gas separates at least two elements, (3) an even number of layers where each layer is electrically connected through asperity contact, (4) multiple-layers where each layer comprises transducer material and electrodes in a substantially same configuration, and (5) electrically isolating electrodes on layers by kerfing or cutting after bonding the layers together.

Transducer array using multi-layered elements having an even number of elements and a method of manufacture thereof

An ultrasonic imaging device for imaging the middle and inner ear is here described. It includes a thin, flattened shaft, a deformable support structure, a mounting surface, and an ultrasonic imaging array. Imaging is effected by the introduction of an acoustically conductive fluid into the middle ear space. Access to the tympanum through the external auditory canal and adjacent to the probe shaft for the purpose of injecting fluid into the middle ear space both before and during the exam is permitted by the flattened probe shaft. The deformable probe shaft may be bent or angulated to best fit a particular patients ear thus permitting optimal access for imaging through the tympanum and around the manubrium of the malleus attached down the midline of the tympanum. High resolution imaging of all structures within the middle and inner ear is achievable.

Ultrasound otoscope

A transducer has tapered piezoelectric layer sides in order to reduce the sidelobe levels. In addition, matching layers disposed on the piezoelectric layer may similarly be tapered to further increase performance. Alternative to tapering the piezoelectric layer, the top electrode and/or the matching layers may be reduced in size relative to the piezoelectric layer such that they generate a wave which destructively interferes with the undesirable lateral wave. There are also described methods for manufacturing a reduced sidelobe transducer.

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Cupertino, CA, United States of America

Worth B Walters