Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Wooseok Ko

Yusin Yang

Chungsam Jun

Sangkil Lee

Jonghwan Kim

Taejin Lee

Sungil Kim

Ilkon Kim

Taejoo Kim

Sungjin Kwon

Minkook Kim

Kwangho Eom

Wonjung Doo

Kyuho Choi

Hyunwoo Kim

Jung Hwan Kim

Souk Kim

Sung Yoon Ryu

Kwanwoo Ryu

A mobile terminal is presented. The mobile terminal includes a display module, a short-range communication module configured to perform short-range communication, and a controller configured to search for at least one device available for short-range communication via the short-range communication module, acquire location information of the at least one searched other electronic device, and display the at least one searched electronic device reflecting the acquired location information on the display module.

Electronic device and control method thereof

A method includes loading a substrate into a sensing chamber; while the substrate is in the sensing chamber, performing a spectral analysis of the substrate; transferring the substrate between the sensing chamber and a processing chamber coupled to the sensing chamber; processing the substrate in the processing chamber to form at least a first layer and/or pattern on the substrate; and based on at least the spectral analysis, determining whether a parameter resulting from the formation of first layer and/or pattern is satisfied.

Method of manufacturing a semiconductor device using semiconductor measurement system

A method of inspecting a semiconductor device includes providing a substrate, on which a mold layer with a plurality of mold openings is provided, milling the mold layer in a direction inclined at a predetermined angle with respect to a direction normal to a top surface of the substrate, such that an inclined cutting surface exposing milled mold openings is formed, the milled mold openings including first milling openings along a first column extending in a first direction and having different heights, obtaining image data of the cutting surface, the image data including first contour images of the first milling openings, and obtaining a first process parameter, which represents an extent of bending of the mold openings according to a distance from a top surface of the substrate, using positions of center points of the first contour images.

Method of inspecting semiconductor device and method of fabricating semiconductor device using the same

A semiconductor inspection system including an ion beam milling unit configured to irradiate at least one cluster-ion beam onto a surface of a sample wafer and etch the surface of the sample wafer and an image acquisition unit configured to irradiate an electron beam onto the etched surface of the sample wafer and acquire an image of the etched surface may be provided.

Semiconductor inspection system and methods of inspecting a semiconductor device using the same

Growing community of inventors

Seoul, South Korea

Wooseok Ko