Samsung Electronics Co., Ltd.

Wooram Kim

Hyunseok Kim

Kihyun Park

Bumhee Lee

Byeongsang Kim

Shin-Ho Choi

Hyeongyu Cho

Sooyun Lee

Sangwook Park

Keonwoo Kim

Seungwon Shin

Dongyun Yeo

Taehyoung Lee

Kyungwon Yun

Eungsu Kim

Geunsik Oh

Hyanjung Lee

Sangil Im

Heewon Min

Sung Chai Kim

Keonho Lee

Namyoung Cho

There is provided an operation method of a memory system which includes a host and a storage device, and the operation method includes allocating a portion of a host memory included in the host for a host memory buffer to be used by a controller of the storage device, setting a set feature command such that the host memory buffer is enabled, setting a retention command including information about a response speed of the host memory buffer, selecting an operation mode of the host memory buffer, based on the retention command, and selecting one of a plurality of power states, which the controller supports, based on a performance objective of the operation mode of the host memory buffer.

Memory system using host memory buffer and operation method thereof

A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

Lift apparatus and substrate processing apparatus including the same

A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

Method of inspecting a semiconductor processing chamber using a vision sensor, and method for manufacturing a semiconductor device using the same

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Incheon, South Korea

Wooram Kim